A wiring structure includes an upper conductive structure, a lower conductive structure and an intermediate layer. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The at least one lower dielectric layer of the lower conductive structure is substantially free of glass fiber. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure.

A substrate bonding structure includes a first substrate including a first resin substrate that melts by heating, a second substrate having a second resin substrate that melts by heating, and an overlapping portion with the first substrate. The overlapping portion between the first substrate and the second substrate includes a hole continuously extending from the first substrate to the second substrate. The first substrate includes a melted portion of the first resin substrate around the hole, and the second substrate includes a melted portion of the second resin substrate around the hole. The first substrate and the second substrate are bonded to each other with a fused portion between the melted portion of the first resin substrate and the melted of the second resin substrate.

A first embodiment of the present invention provides a flexible printed circuit board (FPCB) comprising a hot melt adhesive layer and a metal foil layer sequentially stacked on an insulating layer made of a PCT film; a flexible copper clad laminate (FCCL) having a circuit pattern on the metal foil layer; a coverlay adhered to the hot melt adhesive layer formed on the insulating layer made of the PCT film while covering the metal foil layer and also provides a method of manufacturing the FPCB. A second embodiment of the present invention provides an FPCB having a pressure-sensitive adhesive layer instead of the hot-melt adhesive layer, and a method for manufacturing the FPCB having the same, and the third embodiment of the present invention provides an FPCB having a UV cured layer instead of a hot melt adhesive layer, and a method for manufacturing the FPCB having the same.

An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

A multilayer circuit board includes a first connecting wiring board comprising a first bonding layer and a liquid crystal polymer formed on the first bonding layer. The first bonding layer comprises a first insulating filler. A fusion temperature of the first bonding layer is less than a fusion temperature of the liquid crystal polymer. The multilayer circuit board further includes a first wiring board and a second wiring board disposed on opposite sides of the first connecting wiring board. The first wiring board is combined with the first bonding layer. A method for manufacturing such multilayer circuit board is also provided.

In a preparatory process of a method of manufacturing a multilayer substrate, an insulating substrate is prepared, with a conductor pattern formed only on one surface of the insulating substrate. At that time, the conductor pattern is constituted of the Cu element, a Ni layer is formed on the surface of the conductor pattern that is on the side of the insulating substrate. In a first forming process, a via hole having the conductor pattern as the bottom thereof is formed in the insulating substrate. At that time, the Ni layer that is in the area of the bottom is removed. In a filling process, a conductive paste is filled in the interior of the via hole. In a second forming process, a stacked body is formed by stacking a plurality of the insulating substrates. In a third forming process, the stacked body is heated while being subjected to pressure.

A wiring structure includes an upper conductive structure, a lower conductive structure and an intermediate layer. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure. The intermediate layer includes a plurality of sub-layers. Each of the sub-layers is formed from a polymeric material. A boundary is formed between two adjacent sub-layers.

A wiring structure includes an upper conductive structure, a lower conductive structure, a plurality of metallic structures and an intermediate layer. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The metallic structures are disposed between the upper conductive structure and the lower conductive structure, and electrically connecting the upper conductive structure and the lower conductive structure. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure, and covers the metallic structures.

The electronic card with printed circuit comprises at least one diffraction structure (DS) having a cavity (15) and a diffraction plate (17). In accordance with the invention, the diffraction structure is incorporated in the thickness of the electronic card with printed circuit, the cavity being formed, by removal of material, in the thickness of the electronic card with printed circuit and the diffraction plate being formed in a plate which is arranged on the electronic card with printed circuit and closes the cavity.

A circuit carrier board includes a first build-up layer structure, a substrate, an adhesive layer, and a conductive structure. The first build-up layer includes a plurality of first dielectric layers and a plurality of first circuit layers original stacked. The substrate includes a base and a second build-up layer structure disposed on the base. The second build-up layer structure includes a plurality of second dielectric layers and a plurality of second circuit layer original stacked. A top most layer of the second circuit layers is exposed outside of the second dielectric layers. The conductive structure penetrates through the first dielectric layers, the first circuit layers and the adhesive layer, and contacts with the top most layer of the second circuit layers. The conductive structure electrical connects the first circuit layers to the second circuit layers. A manufacturing method of the circuit carrier board is also provided.