A circuit board assembly has a circuit board and an electrical component embedded in a cured plastic layer, as well as a heat sink for cooling the component. The component is placed with a first side on a surface of the circuit board facing the heat sink and in electrical contact with the circuit board, and is located in a window in the cured plastic layer. Moreover, the component is materially bonded to a surface of the heat sink facing the circuit board at a second side lying opposite the first side, in particular through soldering or sintering. The plastic layer is injected and cured between the surface of the circuit board and the surface of the heat sink. In the production process, the material is melted by the heat at the same time as the injection, such that the component is materially bonded to the heat sink.

The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.

A process for producing a backplane circuit board (20) having an internal face (142) adapted to be connected to connectors (13) of circuit boards (12) and an external face (143) adapted to be connected to an external connector (15), blind holes (146, 148) opening on the internal face (142) and external face (143) of the backplane circuit board (20), wherein bonding layers (31, 32) having zones (41, 42) cleared of material facing the blind holes are used between the printed circuits (21, 22, 23).

Provided is a current sensing device including: a laminate having a plurality of insulating layers laminated therein; a current sensing element provided in an inner layer of the laminate; a current wire configured to flow current to the current sensing element, the current wire being provided with respect to the current sensing element via an interlayer insulating layer; a plurality of current vias configured to connect the current sensing element and the current wire so as to penetrate through the interlayer insulating layer; and a voltage sensing via configured to obtain a voltage drop in the current sensing element, the voltage sensing via being electrically connected to the current sensing element.

Disclosed is a measuring sensor of a measuring device for detecting a mass flow rate. The measuring sensor comprises a measuring tube, a vibration exciter, and at least two vibration sensors. The vibration exciter and the vibration sensors each have a coil apparatus having at least one coil and at least one magnetic apparatus. The coil apparatus comprises a printed circuit board having at least one printed circuit board layer, wherein the coil is formed by means of an electrically conductive conductor track, wherein the coil is arranged on the first side and/or second side of a printed circuit board layer, wherein the printed circuit board comprises at least two contact-making elements for connecting the coil to an electronic measuring and/or operating circuit of the measuring device by means of connection elements, and is characterized in that at least one contact-making element has a hole.

A millimeter wave antenna and a process design of a millimeter wave antenna are provided. The millimeter wave antenna includes a substrate and an antenna attached to the substrate. The substrate includes a first region and a second region. A thickness of the first region is less than a thickness of the second region. The antenna is arranged on the first region. According to the present application, the millimeter wave antenna enables the substrate attached with the antenna to be as thin as possible, such that a medium structure of the first region of the substrate is changed, reducing an energy loss while a millimeter wave is being transmitted.

A method of manufacturing a flexible laminate electronic device and the flexible laminate electronic device itself is disclosed. The method includes placing electronic components over a flexible substrate layer that includes electrical connections between ones of the electronic components. A first flexible additive layer that includes apertures is positioned to align ones of the electronic components in respective ones of the apertures. A subsequent flexible additive layer is arranged over the first flexible additive layer and the apertures are aligned around respective portions of ones of the electronic components protruding above the first flexible additive layer. A flexible cover layer is emplaced over the subsequent flexible additive layer.

The electronic card with printed circuit (1) comprises at least one antenna with slots (AT) including a cavity (15) and a metal conductive layer (17) covering the cavity and having a plurality of slots (S17). The slots form openings in the metal conductive layer. In accordance with the invention, the cavity is formed, by removal of material, in the thickness of the printed circuit. The cavity also comprises a metallisation layer (16) on the walls and the metal conductive layer is formed in a plate attached on the electronic card with printed circuit and closes the cavity.

The present publication discloses a circuit-board structure, including a conductor layer on an insulating material layer, and a conductor pattern on top of the conductor foil. A component is attached to the conductor foil and the conductor pattern, the component embedded at least in part in adhesive which attaches the component to the insulating material layer. A recess is formed in the conductor foil and the insulating material layer, and contact openings are in the insulating material layer at locations of contact areas of the component. Conductor material of the conductor foil is not present outside the conductor pattern, and the conductor foil is located between the conductor pattern and the insulating material layer.

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.