In an antenna in package structure, a plurality of supporting blocks spaced apart from each other are disposed between a first substrate and a second substrate, and an antenna cavity is formed between every two adjacent supporting blocks. Therefore, a height of the supporting block determines a height of the antenna cavity. The supporting blocks spaced apart from each other are located between the first substrate and the second substrate, and at least one of the first substrate or the second substrate adheres to the supporting blocks spaced apart front each other using an adhesive layer.

An electrical connection between the backplane and the light-transmissive front electrode of an electrowetting device is provided by forming an aperture through the top front electrode coupled and a substrate coupled thereto and subsequently introducing a flowable, electrically-conductive material into the aperture. The flowable, electrically-conductive material provides an electrical contact between the light-transmissive electrically-conductive layer and the backplane.

A method of manufacturing a component carrier. The method includes forming a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and embedding a filament in the stack.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members.

The method includes the steps of: laminating a laminate material LM including the support sheet 10 having the columnar metal members 14 formed thereon, a wiring board WB or a wiring board material WB′ having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16′ having a plurality of openings in portions corresponding to the columnar metal members 14 and containing a thermosetting resin such that the columnar metal members 14 are positioned in the respective openings; integrating the laminate material LM by heating and pressing to obtain a laminate LB including a thermosetting resin filled between an inner surface of each of the openings of the wiring board WB or the wiring board material WB′ and each of the columnar metal members 14; and peeling at least the support sheet 14 from the laminate LB.

A component-incorporated substrate of multi-layer structure includes: a plurality of printed wiring base members that are batch-laminated via an adhesive layer, with the plurality of printed wiring base members including a resin base member that includes a wiring pattern on at least one surface thereof and a via connected to the wiring pattern; an opening disposed in at least one printed wiring base member that is sandwiched on both sides by other printed wiring base members of the plurality of printed wiring base members; and an electronic component disposed in the opening. At least part of the wiring pattern of the printed wiring base member where the opening is formed is disposed in a frame shape surrounding the opening, in a periphery of the opening.

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.

A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and −1V. The microrough surface has a roughness Rz of 2-18 μm.

An interconnect substrate includes a lower-modulus buffer material disposed around a thermally conductive base and a higher-modulus crack stopper disposed over the buffer material. By the difference of the elastic modulus between the crack stopper and the buffer material, thermo-mechanical induced stress can be absorbed in the buffer material, and crack propagation would be arrested by the crack stopper to ensure reliability of a routing trace which is deposited on the crack stopper and electrically coupled to vertical connecting elements in the buffer material. Further, the crack stopper can have low dissipation factor to ensure a lower rate of energy loss which is beneficial to high frequency applications.