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Patent classifications
H
ELECTRICITY
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H05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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H05K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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2203/00
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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H05K2203/06
Lamination
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H05K2203/065
Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
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