A substrate bonding structure includes a first substrate including a first resin substrate that melts by heating, a second substrate having a second resin substrate that melts by heating, and an overlapping portion with the first substrate. The overlapping portion between the first substrate and the second substrate includes a hole continuously extending from the first substrate to the second substrate. The first substrate includes a melted portion of the first resin substrate around the hole, and the second substrate includes a melted portion of the second resin substrate around the hole. The first substrate and the second substrate are bonded to each other with a fused portion between the melted portion of the first resin substrate and the melted of the second resin substrate.

In an aspect, a circuit material comprises a multilayer stack comprising alternating layers of a reinforcing layer and a fluoropolymer layer; wherein the fluoropolymer layer comprises a fluoropolymer other than a biaxially-oriented polytetrafluoroethylene; wherein the reinforcing layer comprises a biaxially-oriented polytetrafluoroethylene; and wherein an conductive layer is in direct physical contact with an outer surface of the multilayer stack. In another aspect, an article comprises the circuit material. In yet another aspect, a method of making the circuit material comprises laminating the multilayer stack and the conductive layer to form the circuit material; or laminating a layered stack comprising the conductive layer and alternative layers of the fluoropolymer layers and the reinforcing layer to form the circuit material.

A multilayer printed circuit board (PCB) includes a laminate between a first core and a second core. The first core is located in a middle position of the multi-layer PCB and includes a resistive heating element directly upon a first core substrate. A portion of the resistive heating element protrudes from the multi-layer PCB perimeter. A laminator that fabricates the PCB includes a platen, a power supply, a processor, and memory that has program instructions embodied therewith which are readable by the processor to cause the laminator to position the platen against a surface of the multi-layer PCB and cure the laminate by heating the multi-layer PCB with the platen and cure the laminate by heating the multi-layer PCB with the resistive heating element.

A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.

A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.

A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.

A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.

A substrate bonding structure includes a first substrate including a first resin substrate that melts by heating, a second substrate having a second resin substrate that melts by heating, and an overlapping portion with the first substrate. The overlapping portion between the first substrate and the second substrate includes a hole continuously extending from the first substrate to the second substrate. The first substrate includes a melted portion of the first resin substrate around the hole, and the second substrate includes a melted portion of the second resin substrate around the hole. The first substrate and the second substrate are bonded to each other with a fused portion between the melted portion of the first resin substrate and the melted of the second resin substrate.

To provide a circuit board that has excellent smoothness and capable of reducing a transmission loss of a high-frequency electrical signal.

The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHz having a relative permittivity of from 2 to 3 at 23 C., and the circuit board satisfying a relationship: (AB)/B0.1 wherein A is the maximum value of the thickness in the wiring portion (m) and B is the minimum value of the thickness in the non-wiring portion (m).

A manufacturing method of a component embedded package carrier includes the following steps: providing the dielectric layer; a first copper foil layer and a second copper foil layer; forming a plurality of through holes; forming a conductive material layer on the first copper foil layer and the second copper foil layer; patterning the conductive material layer, the first copper foil layer and the second copper foil layer, thereby defining the conductive through hole structures, the first patterned conductive layer and the second patterned conductive layer and forming the core layer comprises; disposing at least one electronic component inside the opening of the core layer; laminating a first insulating layer and a first circuit layer located on the first insulating layer onto the first patterned conductive layer; laminating a second insulating layer and a second circuit layer located on the second insulating layer onto the second patterned conductive layer.