Provided are a method for producing a metal-clad laminate, including: laminating a prepreg and a metal foil by heating and pressurizing, in which the prepreg contains a thermosetting resin composition and a fiber base material having a thickness of 40 m or more, the prepreg has a first resin layer which is provided on one surface of the fiber base material and contains the thermosetting resin composition; and a second resin layer which is provided on the other surface of the fiber base material and contains the thermosetting resin composition, in which when a thickness of the first resin layer is di and a thickness of the second resin layer is d.sub.2, a ratio R of a thickness difference represented by formula (1) is 9.0% to +9.0%, and surface waviness (Wa) of each of both surfaces of the prepreg is 6 m or less, and a printed wiring board and a semiconductor package using the metal-clad laminate.