Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.

A multilayer ceramic substrate that includes a surface layer portion positioned on an internal layer portion, and a surface layer electrode on a surface of the surface layer portion. The surface layer portion includes a first layer next to the internal layer portion, and the internal layer portion includes a second layer next to the first layer. The thermal expansion coefficient of the first layer is lower than the thermal expansion coefficient of the second layer. The first layer and the second layer each contain glass containing 40 weight % to 65 weight % of MO, where MO is at least one selected from CaO, MgO, SrO, and/or BaO); 35 weight % to 60 weight % of alumina, and 1 weight % to 10 weight % of at least one metal oxide selected from CuO and/or Ag.sub.2O.

A multi-layer circuit board is formed by positioning a top sub having traces on at least one side to one or more pairs of composite layers, each composite layer comprising an interposer layer and a sub layer. Each sub layer which is adjacent to an interposer layer having an interconnection aperture, the interconnection aperture positioned adjacent to interconnections having a plated through via or pad on each corresponding sub layer. Each interposer aperture is filled with a conductive paste, and the stack of top sub and one or more pairs of composite layers are placed into a lamination press, the enclosure evacuated, and an elevated temperature and laminated pressure is applied until the conductive paste has melted, connecting the adjacent interconnections, and the boards are laminated together into completed laminated multi-layer circuit board.

A method for manufacturing a wiring board or a wiring board material includes: obtaining a laminated body LB including the wiring board or the wiring board material having an opening, an embedded member 14 positioned inside the opening, and a cured product of a filling sheet or a coating layer that is integrated with the wiring board or the wiring board material and contains a thermosetting resin 17, the thermosetting resin 17 being filled between an inner surface of the opening of the wiring board or the wiring board material and the embedded member; and removing the cured product of the filling sheet or the coating layer by grinding to obtain a constant thickness of the laminated body.

A bonding method of a flexible display module is provided. The flexible display module includes a flexible display panel having a first bonding area and an integrated driving circuit having a second bonding area. The bonding method includes: attaching, through a colloid, a transfer plate to a surface of the flexible display panel; solidifying the colloid facing the first bonding area to form a fixed portion; flattening the transfer plate to flatten the first bonding area through the fixed portion; aligning the second bonding area with the first bonding area pre-laminating the first bonding area and the second bonding area at a first temperature; breaking the fixed portion, and separating the flexible display panel and the transfer plate; flattening the flexible display panel; laminating the first bonding area and the second bonding area at a second temperature to form the flexible display module.

A method of making a component includes applying a clamping force to the component, the component coupled to a carrier strip of a panel via a polymeric tab and separating a portion of the polymeric tab from a substrate of the component, thereby causing the component to be detached from the panel.

A method for forming a substrate structure for an electrical component includes placing an electrically insulating laminate on a substrate and applying hot pressure to the electrically insulating laminate by a heatable plate. An average temperature of a surface temperature distribution within a center area of the heatable plate is higher than 80 C. during applying the hot pressure. Further, an edge area of the heatable plate laterally surrounds the center area and a temperature of the heatable plate within the edge area decreases from the center area towards an edge of the heatable plate during applying the hot pressure. A temperature at a location located vertically above an edge of the substrate during applying the hot pressure is at least 5 C. lower than the average temperature of the surface temperature distribution within the center area.

The wiring board according to the present disclosure includes: a first insulating layer including insulating particles; a plurality of first conductors located on the first insulating layer at an interval of a first distance from each other; a second conductor located on the first insulating layer at an interval of a second distance from the first conductor; and a second insulating layer located on the first insulating layer to cover the first conductor and the second conductors and including the insulating particles. When a boundary portion between the first insulating layer and the second insulating layer is viewed in cross-section in the thickness direction, the ratio of a first area occupied by the insulating particles in a first boundary portion including the first distance is higher than the ratio of a second area occupied by the insulating particles in a second boundary portion including the second distance.

A copper-clad laminate is prepared by laminating a copper foil on one side or both sides of a polyimide film by thermocompression bonding. The flexibility of the copper-clad laminate is remarkably improved by employing a polyimide film having a thickness of 5 to 20 ?m and a copper foil having a thickness of 1 to 18 ?m.

A multi-layer circuit board is formed by positioning a top sub having traces on at least one side to one or more pairs of composite layers, each composite layer comprising an interposer layer and a sub layer. Each sub layer which is adjacent to an interposer layer having an interconnection aperture, the interconnection aperture positioned adjacent to interconnections having a plated through via or pad on each corresponding sub layer. Each interposer aperture is filled with a conductive paste, and the stack of top sub and one or more pairs of composite layers are placed into a lamination press, the enclosure evacuated, and an elevated temperature and laminated pressure is applied until the conductive paste has melted, connecting the adjacent interconnections, and the boards are laminated together into completed laminated multi-layer circuit board.