A resist layer forming method includes a process of laminating a resist layer on a base at a first pressure using a laminate roller having a first temperature, and a process of pressing the resist layer against the base at a second pressure higher than the first pressure using a metal plate having a second temperature lower than the first temperature.

A multilayer substrate includes a laminated body including thermoplastic resin layers, a conductor pattern, a level-difference eliminating through hole, and a thickness adjustment member. The conductor pattern is on a main surface of one of the resin layers and is in the laminated body. The level-difference eliminating through hole is located at a position different from the conductor pattern in a planar view of the laminated body and penetrates the resin layer in a thickness direction. The thickness adjustment member is made of the same material as the resin layers, is located in the through hole, and has a thickness greater than a thickness of the resin layer.

A method of making a component includes applying a clamping force to the component, the component coupled to a carrier strip of a panel via a polymeric tab and separating a portion of the polymeric tab from a substrate of the component, thereby causing the component to be detached from the panel.

A method of manufacturing a press pad is disclosed. The method includes: providing a planar pad having a first surface and a second surface opposite to the first surface and a release film sheet, the release film sheet including a polyimide-based film; cleaning the planar pad, the cleaning including electrostatically removing particulates from surfaces of the planar pad; and attaching a release film sheet to the first surface of the planar pad, the release film sheet being attached to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

Resin films, all of which are formed of the same resin material, are laminated to form a laminate. Heat and pressure are applied to the laminate to integrate the resin films into one piece; then the pressure applied to the laminate is released and the laminate is cooled. In a predetermined region of the laminate which is to constitute a bent part, one or more of the resin films are arranged on each of one side and the other side in a lamination direction of the resin films with respect to one conductor pattern; and the total thickness of the one or more resin films arranged on the one side is larger than the total thickness of the one or more resin films arranged on the other side. Consequently, the predetermined region can be bent by utilizing the difference between contraction force generated in the one or more resin films arranged on the one side and contraction force generated in the one or more resin films arranged on the other side during the cooling after the application of heat and pressure.

A method of producing a double-sided metal-clad laminate comprises a supplying step of supplying an insulating film interposed between two metal foils continuously to between a pair of endless belts, a heat and pressure applying step of forming a laminate of the insulating film and the metal foils by heating and applying a pressure to the insulating film and the metal foils under predetermined condition while the insulating film is interposed by the two metal foils in between the endless belts, and a cooling step of cooling the laminate, wherein the insulating film has a thickness of 10 to 500 μm, a degree of planar orientation of 30% or more, an average coefficient of linear expansion in an MD direction of −40 to 0 ppm/K and an average coefficient of linear expansion in a TD direction of 0 to 120 ppm/K.

Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.

A board-to-board connecting structure which adds no significant thickness to a single printed circuit board includes a first circuit board and a second circuit board. The first circuit board includes first circuit substrate, adhesive layer, and second circuit substrate. The first circuit substrate includes first base layer, first inner wiring layer with first pad, and first outer wiring layer defining a receiving space. The second circuit substrate includes insulating layer and two second outer wiring layers. A conductive via in the second circuit substrate connects the two second outer wiring layers. The second circuit board includes second base layer and also two third outer wiring layers each with a second pad. The second circuit board is laterally disposed in the receiving space and one second pad connects to the conductive via and the other to the first pad.

A printed circuit board includes: a first insulating layer; a first circuit layer disposed on one surface of the first insulating layer; a second insulating layer disposed on the first insulating layer and covering at least a portion of the first circuit layer; a via conductor passing through the second insulating layer and connected to the first circuit layer; a via land connected to the via conductor in an upper portion of the via conductor; and a second circuit layer disposed on the second insulating layer and connected to the via land. The via conductor and the via land have a first interface where the via conductor and the via land are in contact with each other.