A wiring board includes a first substrate, a second substrate composed of a material different from a material of the first substrate, a wiring supported by the first substrate, and a terminal supported by the second substrate and connected to the wiring. The first and second substrates are disposed on a same side with respect to the wiring. In a plan view, the first substrate overlaps the wiring but not the terminal. In the plan view, the second substrate overlaps the terminal.

The invention regards a press for soldering multilayer stacks for printed circuits, with an outer muffle that encloses soldering chambers where multilayer stacks are arranged to be heated, inducing a magnetic flux. For such purpose, the press is provided with an inductor having winding form which is arranged on a mobile piston adapted to apply a force on the multilayer stack, such to generate a magnetic flux at its interior that is spatially uniform and regular over time.

A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.

A pressing area set on a main surface of a plate-shaped holding jig is arranged on contact parts. The contact parts are pressed against a multilayer board while heating the multilayer board and the pressing area of the holding jig is inclined with a warp of the multilayer board. In this way, when pressing for bonding the contact parts is performed, even if the multilayer board is warped by the heating and the contact parts are shifted, the contact parts are pressed against the multilayer board without fail.

The invention is a laminate having a resin layer containing a crystalline alicyclic structure-containing resin and a metal layer in direct contact with the resin layer, wherein an average linear expansion coefficient of the resin layer at 60 to 100° C. is 5 to 50 ppm/° C., and a ten-point average roughness (Rz) on an interface between the resin layer and the metal layer is 2.0 μm or less, and a method for producing the laminate, and a flexible printed circuit board using the laminate. One aspect of the invention provides a laminate which has a resin layer and a metal layer in direct contact with the resin layer and is suitably used as a substrate material, and a production method therefor, as well as a flexible printed circuit board using the laminate.

A multilayer printed circuit board (PCB) includes a laminate between a first core and a second core. The first core is located in a middle position of the multi-layer PCB and includes a resistive heating element directly upon a first core substrate. A portion of the resistive heating element protrudes from the multi-layer PCB perimeter. A laminator that fabricates the PCB includes a platen, a power supply, a processor, and memory that has program instructions embodied therewith which are readable by the processor to cause the laminator to position the platen against a surface of the multi-layer PCB and cure the laminate by heating the multi-layer PCB with the platen and cure the laminate by heating the multi-layer PCB with the resistive heating element.

The present disclosure provides a printed circuit board and a manufacturing method of the printed circuit board. The manufacturing method may include: at least two core plates may be provided; a composite anti-glue film assembly may be arranged at a preset position of one of the at least two core plates, the composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer. The first anti-glue film layer may contact the preset position. The first anti-glue film layer may be a polyimide layer. The bonding layer may be configured to bond the first anti-glue film layer and the second anti-glue film layer together to produce the composite anti-glue film assembly. Two adjacent core plates may be connected through a media layer. The core plates may be cut-out and form the printed circuit board.

A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

A multilayer circuit board includes a first connecting wiring board comprising a first bonding layer and a liquid crystal polymer formed on the first bonding layer. The first bonding layer comprises a first insulating filler. A fusion temperature of the first bonding layer is less than a fusion temperature of the liquid crystal polymer. The multilayer circuit board further includes a first wiring board and a second wiring board disposed on opposite sides of the first connecting wiring board. The first wiring board is combined with the first bonding layer. A method for manufacturing such multilayer circuit board is also provided.

A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.