The present invention relates to a method for formation of a redistribution layer using photo-sintering and to the redistribution layer formed by the method. The method for forming a redistribution layer using photo-sintering includes printing, on a substrate, a liquid electrode pattern for a redistribution layer; coating a transparent polymer on the substrate and the pattern; photo-sintering the electrode pattern using photonic energy; and evaporating an organic substance contained in the liquid electrode pattern via the photo-sintering to remove the polymer on a top face of the electrode pattern to form a redistribution layer as the sintered electrode pattern.

Techniques and mechanisms for promoting heat conduction in a packaged device using a heat spreader that is fabricated by a build-up process. In an embodiment, 3D printing of a heat spreader successively deposit layers of a thermal conductor material, where said layers variously extend each over a respective one or more IC dies. The heat spreader forms a flat top side, wherein a bottom side of the heat spreader extends over, and conforms at least partially to, different respective heights of various IC dies. In another embodiment, fabrication of a portion of the heat spreader comprises printing pore structures that contribute to a relatively low thermal conductivity of said portion. An average orientation of the oblong pores contributes to different respective thermal conduction properties for various directions of heat flow.

A system and method for applying a coating to a substrate are disclosed. The system includes a coating station for applying a coating material to the substrate, where the coating station has a bottom portion, an oven for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion, and a first lift for transporting the substrate from the coating station to the oven. The system can also include an inspection station for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.

The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.

Systems and methods for dispensing a liquid or viscous material onto a substrate are disclosed herein. One exemplary method of positioning an applicator of a dispensing system to apply a liquid or viscous material to an electronic substrate includes generating a two-dimensional image of the electronic substrate using a camera communicatively connected to the dispensing system. Based on the two-dimensional image of the electronic substrate, a first set of one or more sub-regions of the electronic substrate having one or more components that protrude above the surface of the electronic substrate is identified. The method further includes using height information relating to the one or more sub-regions having the one or more components to determine a control program for the dispensing system to position the applicator relative to the electronic substrate and dispense the liquid or viscous material onto the electronic substrate.

A radiation curable solder mask inkjet ink contains a photo-initiator, a polymerizable compound and a flame retardant wherewith a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties and flame retardancy may be produced.

Described is a composition suitable for the preparation of an electroconductive transparent layer, said composition comprising a mixture of water and one or more alcohols, electroconductive nanoobjects and one or more dissolved styrene/(meth)acrylic copolymers.

The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and an unsaturated compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the unsaturated compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The unsaturated compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.

A method to fabricate a tamper respondent assembly is provided. The tamper respondent assembly includes an electronic component and an enclosure at least partly enclosing the electronic component. A piezoelectric sensor is integrated in the enclosure. The integrating includes providing a base structure that includes a first conductive layer, depositing a piezoelectric layer on the first conductive layer, covering the piezoelectric layer with a second conductive layer, and providing sensing circuitry for observing sensing signals of the piezoelectric layer. The piezoelectric layer includes a plurality of nanorods. Aspects of the invention further relates to a corresponding assembly and a corresponding computer program product.

A method of, and system for, providing an amorphous fluorinated polymer conformal coating to an RF circuit board is described. A coating solution including the amorphous fluorinated polymer dissolved in a fluorinated solvent is provided. The coating solution is applied to the RF circuit board via a mechanically controlled fluid spray application device to produce a coated board. A predetermined time period is waited for substantial evaporation of the fluorinated solvent from the coated board, thus leaving behind a conformal coating of the amorphous fluorinated polymer on a board surface area.