A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.

A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.

A heating apparatus includes a gas supply for providing a base gas, a generator configured to excite the base gas to produce a metastable gas mixture that includes a metastable gas, and a housing. The housing includes a wall shaped to contain the metastable gas mixture and selectively enclose a reactive element of a target component. Interaction between the metastable gas and at least one of a coupling material and the reactive element transfers energy to selectively heat the at least one of the coupling material and the target component.

The invention discloses, pickup method, equipment and EMI electromagnetic shielding layer manufacturing method of SiP module. The method for picking up the SiP module comprises the following steps: A nozzle descends to touch the upper surface of the SiP module; the nozzle sucks the SiP module; an air thimble ascends to touch the lower surface of the carrier; the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble; compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened; the nozzle ascends and picks up the SiP module.

A process and device for removing a solid ink mask printed onto a substrate is disclosed. The substrate is bent around a bar set perpendicular to the substrate, causing the mask to flake off the substrate. The process permits fast removal of solid ink masks.

An applying apparatus that applies a flux liquid includes: a nozzle from which the flux liquid is injected; and an intake and exhaust unit that sucks the flux liquid injected from the nozzle through an intake port and exhausts a gas through an exhaust port. The intake and exhaust unit has a filtering unit that filters the flux liquid sucked through the intake port and through which the gas passes before the gas reaches the exhaust port. The filtering unit is movably provided within the intake and exhaust unit so that when installing/removing the filtering unit with respect to the intake and exhaust unit, the filtering unit moves in a direction substantially parallel to a direction in which the flux liquid is sucked through the intake port and in which the gas is exhausted through the exhaust port.

The invention relates to an apparatus for the coating of a substrate, in particular of a circuit board, with a material application device for applying a coating material and with a gas supplying device for the supply of a gaseous medium, the material application device having an inner tubular element, the gas supply device having an outer tubular element which is arranged coaxially to the inner tubular element and surrounds the latter, so as to form between the outer and the inner tubular element a gas supply duct which has an annular orifice at one end, the supply duct being configured so that the gaseous medium flows out, parallel to the coating material, through the annular orifice, in order, when it impinges on the substrate, to displace the applied coating material and thereby distribute it over the area. The apparatus is distinguished in that the material application device has a jet valve which, in a first operating mode, carries out a jetted supply of material into the inner tubular element.

Solder housed in flow tank 20 is ejected from nozzle 22 by a pump provided inside flow tank 20. Jet motor 26 that drives the pump is provided outside flow tank 20, and cooling device 30 is provided between flow tank 20 and jet motor 26. Cooling device 30 includes cooling pipe 52 that is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe 52, flows along cooling pipe 52, and flows out of a lower end of cooling pipe 52 so as to be supplied to flow tank 20. The temperature of the nitrogen gas increases due to heat dissipated from jet motor 26, thus lowering the temperature of jet motor 26. Heat is transferred from jet motor 26 to the nitrogen gas, and jet motor 26 is cooled satisfactorily.

A portable baking assembly includes a portable housing, a receiving base, and an air flow assembly. The receiving base is disposed in the portable housing. The receiving base is operable to receive a processing unit assembly including a processing unit, a thermal solution, and a thermal interface material operable to couple the processing unit and the thermal solution. The air flow assembly is received in the portable housing and in fluid communication with the receiving base. The air flow assembly includes an inlet conduit that is operable to receive heated air and direct the heated air towards the receiving base to heat the processing unit assembly and cure the thermal interface material.

In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.