A display apparatus comprises a display panel comprising a plurality of driving elements to drive pixels and a first terminal group electrically connected to the driving elements; a supporting member comprising a surface on which the display panel is to be placed and comprising, on the surface, a plurality of wirings and a second terminal group connected to the plurality of wirings; and a holding member provided along an edge of the display panel using a rod-shaped material having a linear or curved shape to hold the display panel on the surface of the supporting member, wherein the first terminal group is provided on a surface of the display panel to be directed to the supporting member; and the display panel is placed on the surface of the supporting member, and each of terminals constituting the first terminal group is connected to each of terminals constituting the second terminal.

An encapsulated circuit board assembly has a circuit board assembly that includes a substrate with a first surface and one or more electronic components mounted to the first surface to form an irregularly contoured front side of the circuit board assembly. A thermoformed sheet encapsulates the irregularly contoured front side of the circuit board assembly. Vacuum forming and pressure forming methods are used to apply a thermoformable sheet to the irregularly contoured front side of the circuit board assembly.

The object of the invention is to provide a double-sided circuit non-oxide-based ceramic substrate excellent in radiation property and low in cost, and a method for manufacturing the same. A double-sided circuit non-oxide-based ceramic substrate related to the present invention includes a high heat-conductive non-oxide-based ceramic substrate that includes a through hole, a holding layer that is formed on a wall surface of the through hole, and an electro-conductive metal section that is held inside the through hole by the holding layer and does not include an active metal. The double-sided circuit non-oxide-based ceramic substrate related to the present invention preferably includes electrodes (thin film electrodes) that shield end surfaces of the holding layer and end surfaces of the electro-conductive metal section which are exposed to front and back surfaces of the ceramic substrate.

An ultrasonic bonding head includes a vibrator unit, a holder, and a pressurizing shaft. The vibrator unit includes a press part formed at a tip of the vibrator unit in a longitudinal axis thereof and configured to press a bonding scheduled part to be bonded. The holder holds a base of the vibrator unit in a cantilever manner so that the tip is a free end. The pressurizing shaft is connected with the holder and transmits a force of pressing the press part against the bonding scheduled part so that the vibrator unit moves substantially perpendicularly to the longitudinal axis. The holder is provided with a restraint portion. The restraint portion contacts with the vibrator unit at a counterforce dispersion position located between a main hold position for holding the vibrator unit by the holder and the free end.

Systems and methods for laser assisted deposition of a material includes a printing unit configured to print individual dot-like portions of a material from a donor substrate onto a receiving substrate, and a vacuum shuttle configured to be positionable in two or three dimensions between the printing unit and the donor substrate and to engage the donor substrate upon application of a vacuum to the vacuum shuttle. The printing unit may include a coating system and a laser. The vacuum shuttle includes a vacuum channel about its periphery and an open window through which the laser irradiates the donor substrate. The vacuum channel is fluidly coupled to a vacuum inlet for receiving a vacuum suction, thereby to engage the donor substrate and hold it taught against the bottom of the vacuum shuttle in operation. The vacuum shuttle may also include one or more distance measuring sensors and fiducial markers.

Disclosed is a method for fabricating a micro-LED module. The method includes: preparing a circuit board; forming solder bumps on one surface of the circuit board; arranging micro-LED chips on the one surface of the circuit board such that the micro-LED chips are in contact with the solder bumps; heating the solder bumps to bond the micro-LED chips to the one surface of the circuit board through the solder bumps; arranging driver ICs on the other surface of the circuit board such that the driver ICs are in contact with solders on the other surface of the circuit board in a state in which the micro-LED chips are bonded to the circuit board; and heating the solders to bond the driver ICs to the other surface of the circuit board through the solders. The micro-LED chips are arranged on the one surface of the circuit board after the flatness of the circuit board is enhanced.

A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.

Methods and system which eliminate steps in the mounting a discrete device to an electronic circuit using a conductive film, shortening the time required to attach each discrete device. The methods place a discrete device onto the conductive tape and partially cure portions of the adhesive. The discrete device is then removed from the conductive tape along with the adhesive and conductive particles which have been transferred onto the contact pads of the discrete device. The discrete device is then placed on the substrate and aligned. Pressure and heat are applied to complete the bond.

In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.

An LED light source module comprises a double-sided circuit board and two rivets electrically connected to both sides of the double-sided circuit board. The rivet includes a nail head, a shank, and a transition section connecting the nail head and the shank. The length of the nail head in a section along the thickness direction of the circuit substrate is greater than the width of the shank, and the transition section is a trapezoid. The short side of the trapezoid is connected to the shank, and the length of the long side of the trapezoid is smaller than the length of the nail head. The nail head is connected to the first wiring layout, and the shank is electrically connected to the second wire pattern by soldering tin. The first and second wiring layouts are electrically connected by the rivet, and the copper plating process with more serious pollution is not used, thereby reducing the cost of pollution control, and the circuit substrate of the lower-level material can be used, and further the competitiveness of the lamp having the LED light source module can be improved.