A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.

The present invention provides a manufacturing method of a curved circuit board which includes the following steps. The first step is to provide a flexible substrate. The next step is to form a patterned catalyst layer on the flexible substrate. The next step is to deposit metal on the patterned catalyst layer by electroless plating to form a wiring substrate, wherein the wiring substrate includes a planar wiring structure. The last step is to place the wiring substrate into a mold having a molding surface with a three-dimensional design, and then execute a heating process to shape the planar wiring structure to a three-dimensional wiring structure, wherein the heated wiring substrate is laminated to the molding surface of the mold. The present invention further provides an electronic product using the curved circuit board.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

Disclosed herein is a roll-to-roll long base material surface processing device capable of performing surface processing on a long base material with little occurrence of wrinkling in the long base material at low costs. The surface processing device includes: two can rolls that cool a long resin film transferred in a roll-to-roll manner in a vacuum chamber with a cooling medium circulated therein by wrapping the long resin film around outer circumferences thereof; and surface processing units typified by magnetron sputtering cathodes provided so as to face the outer circumferences of the two can rolls, wherein a second can roll of the two can rolls other than a most upstream first can roll has a gas release mechanism that releases a gas from the outer circumference.

A system that may include a apertured structure that is configured to support a substrate and a vacuum supply unit that is configured to (i) prevent a supply of vacuum to a first area of the substrate during a first processing period during which the first area is processed and a second area of the substrate is not processed; (ii) provide vacuum to the second area during the first processing period; (iii) prevent the supply of vacuum to the second area during a second processing period during which the second area is processed and the first area is not processed; and (iv) provide vacuum to the first area during the second processing period.

A display device includes a display panel, a first circuit board, a second circuit board, a first adhesive element, and a conductive element. The display panel includes a non-bending region and a bending region that is bent from the non-bending region. The bending region includes a curvature region having a specific curvature and a facing region facing the non-bending region in a thickness direction of the display module. The first adhesive element is disposed to combine the first circuit board with the second circuit board, and the conductive element is disposed to electrically connect the first circuit board to the second circuit board.

Embodiments disclosed include a multilayer substrate for semiconductor packaging. The substrate may include a first layer with a first side with an xy-plane and individual locations on the first side have a first side distance below the first side xy-plane, and a second side with a second side xy-plane and individual locations on the second side may have a second side distance below the second side xy-plane; and a second layer with a first side coupled to the second side of the first layer and a second side opposite the first side of the second layer, wherein a thickness of the second layer at the individual locations on the second layer may be comprised of the first side distance plus the second side distance. Other embodiments may be described and/or claimed.

The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the chamber 40, a pump 23 that evacuates the chamber 40, and a control portion 61 that calculates the amount of decrease in the degree of vacuum when evacuating the chamber 40 using a predetermined pump output, sets the calculated value as a reference value and switches an evacuation property from the evacuation property including a lower pump output to the evacuation property including a higher pump output when the calculated amount of decrease in degree of vacuum in real time has become smaller than the reference value.

A housing has a first positioning hole that penetrates the housing in the vertical direction. A suction cap includes a suction plate part to be sucked by a suction nozzle, and a plurality of positioning protrusion parts, each of which is to be inserted into a first positioning hole of the housing of an input/output board-side connector and a CPU board-side connector in the state where the suction cap holds the input/output board-side connector and the CPU board-side connector. Each positioning protrusion part is inserted into each corresponding first positioning hole in the state where the suction cap holds the input/output board-side connector and the CPU board-side connector, which achieves the positioning of the input/output board-side connector and the CPU board-side connector with respect to the suction cap.

A heat-bonding apparatus and method of manufacturing a heat-bonded product without overheating during cooling thereof after the completion of the heat-bonding, where the object can be cooled in a shorter time than the conventional when the heat-bonding is performed in a vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part placed into contact with the object, an object temperature sensor for detecting a temperature of the object heated through the buffer part, a buffer temperature sensor for detecting a temperature of the buffer part, a vacuum breaker for breaking the vacuum, and a controller for operating the vacuum breaker to break the vacuum when a temperature difference between a temperature detected by the object temperature sensor and a temperature detected by the buffer temperature sensor falls within a range of specified temperature difference.