A reel-to-reel lamination method to laminate a metal foil or circuitry pattern on the fly. The method includes applying a UV laminate or thermoset laminate to the metal foil or the circuitry pattern reel to reel, and then apply a UV radiation or heat to the laminate. There can be an optional enclosure connected to a suction source. The enclosure can have a flexible bladder that physically compresses the laminate.

The invention concerns a reflow soldering machine for continuously soldering of soldering goods in a process channel along a process direction, whereby the process channel comprises at least one pre-heating zone, at least one soldering zone, and at least one cooling zone, whereby the soldering zone comprises a pressure chamber comprising one base part and one cover part opposite the base part and that can be raised when the reflow soldering machine is operating, wherein the process channel can be covered by at least one covering hood that can be opened, and wherein the cover part is motion-coupled to the covering hood in such a way that when the covering hood is opened, the cover part is also taken along by the covering hood.

A vacuum wiper, comprising a housing, a connection port, multiple holes and a hole adjusting means; the housing contains a cavity; the connection port is disposed on the housing and is in communication with the cavity; the multiple holes are disposed on the housing in the length direction of the housing, such that the cavity of the vacuum wiper housing is able to be in fluid communication with the outside via the multiple holes. The vacuum wiper has a maximum vacuumizing length when all of the multiple holes are in communication with the outside. The hole adjusting means is configured to be capable of blocking one or more of the multiple holes in sequence from two ends in the length direction of arrangement of the multiple holes of the vacuum wiper, such that the vacuum wiper is able to adjust the vacuumizing length. The provision of the hole adjusting means enables the vacuum wiping apparatus to have an adjustable vacuumizing length, in order to match the wiping of stencils with different length specifications, thereby effectively increasing the vacuumizing efficiency of the vacuum wiping apparatus and reducing the production cost.

A method for producing a joined structure according to the present invention includes: a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material, the reflow step including: a first reflow step of melting the solder alloy with an atmosphere in the reflow chamber reduced to a first pressure P.sub.1 lower than the atmospheric pressure; and a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure P.sub.2 lower than the first pressure P.sub.1.

A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules. The protective material conformally covering the top of the electronic modules is heated to a second temperature to solidify the protective material conformally covering the top of the electronic modules to form a protective film conformally covering the top of the electronic modules.

A device comprises a first sealing member, a second sealing member, a first circuit member and a second circuit member. The first sealing member comprises, as a base thereof, a first film formed of a film and comprises a conductive portion made of conductor. The device is formed with a closed space. The closed space is enclosed by the first sealing member and the second sealing member and is shut off from an outer space located outside the device. The first circuit member and the second circuit member are shut in the closed space and comprise a first contact point and a second contact point, respectively. At least one of the first circuit member and the second circuit member comprises an electrode. The conductive portion is in contact with the electrode in the closed space and is partially exposed to the outer space located outside the device.

A device comprises a first sealing member, a second sealing member, a first circuit member and a second circuit member. The first sealing member basically comprises a first film formed with an opening and comprises a frame film. At least one of the first circuit member and the second circuit member comprises an exposed portion and a seal portion which surrounds the exposed portion. The frame film has a film-seal portion and a circuit-seal portion. The film-seal portion is bonded to the first film to surround the opening. The circuit-seal portion is bonded to the seal portion to surround the exposes portion. The device is formed with a closed space which is enclosed by the first sealing member and the second sealing member. The exposed portion is exposed to the outer space located outside the device.

A vacuum wiper, comprising a housing, a connection port, multiple holes and a hole adjusting means; the housing contains a cavity; the connection port is disposed on the housing and is in communication with the cavity; the multiple holes are disposed on the housing in the length direction of the housing, such that the cavity of the vacuum wiper housing is able to be in fluid communication with the outside via the multiple holes. The vacuum wiper has a maximum vacuumizing length when all of the multiple holes are in communication with the outside. The hole adjusting means is configured to be capable of blocking one or more of the multiple holes in sequence from two ends in the length direction of arrangement of the multiple holes of the vacuum wiper, such that the vacuum wiper is able to adjust the vacuumizing length. The provision of the hole adjusting means enables the vacuum wiping apparatus to have an adjustable vacuumizing length, in order to match the wiping of stencils with different length specifications, thereby effectively increasing the vacuumizing efficiency of the vacuum wiping apparatus and reducing the production cost.

A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.

An ultrasonic bonding head includes a vibrator unit, a holder, and a pressurizing shaft. The vibrator unit includes a press part formed at a tip of the vibrator unit in a longitudinal axis thereof and configured to press a bonding scheduled part to be bonded. The holder holds a base of the vibrator unit in a cantilever manner so that the tip is a free end. The pressurizing shaft is connected with the holder and transmits a force of pressing the press part against the bonding scheduled part so that the vibrator unit moves substantially perpendicularly to the longitudinal axis. The holder is provided with a restraint portion. The restraint portion contacts with the vibrator unit at a counterforce dispersion position located between a main hold position for holding the vibrator unit by the holder and the free end.