A method for manufacturing a flexible circuit board with resistor which is buried in the board includes steps of providing a composite board, the composite board comprising a substrate, and a physical development core layer formed on the substrate. A silver halide emulsion layer is formed on the physical development core layer and the silver halide emulsion layer is exposed. A developing solution is applied to the halide emulsion layer and washed to form a silver layer on the substrate. A conductive layer is formed on the silver layer and the conductive layer is etched, forming at least one opening. Such opening exposes a portion of the silver layer which contains a buried resistor. Different processes and materials applied in the above procedure serve to increase or decrease the resistance of the resistor as desired.

Provided is a method for fabricating a strain-pressure complex sensor and a sensor fabricated thereby. This method includes coating a fabric with a graphene oxide; reducing the graphene oxide coated with the fabric to form a graphene; disposing carbon nanotubes on the fabric coated with the graphene; and connecting an electrode to the fabric.

Provided is a chip mounter, an electronic circuit substrate, and a power module, where the chip mounter prevents foreign substances from a chip-mounter installation environment, dust generated from members, and dust generated from the chip mounter, thereby preventing failures caused by the foreign substances. The chip mounter takes out a chip component accommodated in a packing tape. The packing tape has a pocket. The pocket has a bottom surface provided with a through hole. The chip mounter includes a tape travelling rail, a sucking-and-mounting arm, and a cavity cleaning mechanism. The cavity cleaning mechanism includes an intake hole disposed upstream of a suction point, in a location of the tape travelling rail, on which the carrier tape with a cover tape attached thereto travels so as to overlap the through hole. The cavity cleaning mechanism takes in the inside of the pocket through the intake hole and the through hole.

Provided is a chip mounter, an electronic circuit substrate, and a power module, where the chip mounter prevents foreign substances from a chip-mounter installation environment, dust generated from members, and dust generated from the chip mounter, thereby preventing failures caused by the foreign substances. The chip mounter takes out a chip component accommodated in a packing tape. The packing tape has a pocket. The pocket has a bottom surface provided with a through hole. The chip mounter includes a tape travelling rail, a sucking-and-mounting arm, and a cavity cleaning mechanism. The cavity cleaning mechanism includes an intake hole disposed upstream of a suction point, in a location of the tape travelling rail, on which the carrier tape with a cover tape attached thereto travels so as to overlap the through hole. The cavity cleaning mechanism takes in the inside of the pocket through the intake hole and the through hole.

According to the present invention, a heat-dissipating circuit board is formed by providing a metal material adjacent to one surface of an insulating layer and providing a conductive metal layer to the other surface of the insulating layer. The metal material is a sheet of copper or a copper alloy or aluminum or an aluminum alloy and is 0.2-20 mm thick. The insulating layer is a metal oxide layer that has the composition AlxOyTz, is 0.2-30 ?m thick, has a volume resistivity of at least 1000 G?.Math.cm, and has a porosity of no more than 10%. The heat-dissipating circuit board has excellent heat-dissipation properties and insulation properties.

A method for creating patterned coatings on a molded article includes providing a molded article which has a surface comprising a first area and a second area, at least one surface property in the first area of the surface being different from that in the second area, applying a coating covering at least the first area and the second area to the surface of the molded article, the adhesion of said coating being greater in the first area than in the second area because of the at least one different surface property, and partially removing the coating by means of a removal process which is applied to the entire coating at a constant removal power that is determined such that the entire coating is removed in the second area while the coating remains in place on an entire surface of the first area.

According to the present invention, a heat-dissipating circuit board is formed by providing a metal material adjacent to one surface of an insulating layer and providing a conductive metal layer to the other surface of the insulating layer. The metal material is a sheet of copper or a copper alloy or aluminum or an aluminum alloy and is 0.2-20 mm thick. The insulating layer is a metal oxide layer that has the composition AlxOyTz, is 0.2-30 m thick, has a volume resistivity of at least 1000 G.Math.cm, and has a porosity of no more than 10%. The heat-dissipating circuit board has excellent heat-dissipation properties and insulation properties.

An electronic circuit assembly comprises a substrate and circuit components attached to the substrate by means of an electrically conductive adhesive, wherein the adhesive is releasable under predetermined release conditions, whereby to enable the circuit components to be removed from the substrate for recovery or re-use.