A method of mounting electronic devices, including the steps of: irradiating with microwaves a board for mounting electronic devices including a base, a plurality of solder parts on the base, and a plurality of electronic devices corresponding to the plurality of solder parts placed in contact with the plurality of solder parts, the microwave irradiation is performed in a state in which electromagnetic shielding is performed for some of the plurality of solder parts; and heating and melting at least the solder parts for which the electromagnetic shielding is not performed by an action of a magnetic field of a standing wave formed by the microwave irradiation.

A method for preventing a molded body made of low melting point resin from being thermally damaged when external connection terminals provided on the molded body and external connection terminals provided on a flexible sheet are joined together via soldering. The method includes arranging the connection terminal of the molded body and the connection terminal of the flexible sheet such that the connection terminals face each other, and an electromagnetic induction heating performing electromagnetic induction heating after the arranging.

Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

The present invention includes the steps of applying a liquid deposition material on a display surface of a display panel through a metal mask which is in close contact with the display surface of the display panel, while heating the metal mask; and forming thin film patterns by heating and baking the applied liquid deposition material.

The invention relates to a method for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction. In particular, a magnetic flux is locally induced at a plurality of conducting spacers (25) provided along a peripheral area (22) of the multilayer stack (18). By this method, it is possible to induce magnetic fluxes with opposite sign in individual areas of the peripheral area, thus achieving the maximum energy efficiency during the bonding process. The invention further comprises an induction head and a bonding apparatus for performing the method.

An induction head for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction. A magnetic flux is locally induced at a plurality of conducting spacers (25) provided along a peripheral area (22) of the multilayer stack (18). With this induction head, it is possible to induce magnetic fluxes with opposite sign in individual areas of the peripheral are, thus achieving the maximum energy efficiency during the bonding process.

A structure with an electronic component array positioned between two stacked printed circuit boards (600,606) is disclosed. The electronic components (502) of the array can be connected to the printed circuit board (600,606) by way of solder connections. Example electronic components (502) include capacitors. Related methods of manufacture are disclosed that involve applying heat to a solder paste array on a printed circuit board (600,606) to form solid conductors electrically connected to the electronic components (502).

A structure with an electronic component array positioned between two stacked printed circuit boards is disclosed. The electronic components of the array can be connected to the printed circuit board by way of solder connections. Example electronic components include capacitors. Related methods of manufacture are disclosed that involve applying heat to a solder paste array on a printed circuit board to form solid conductors electrically connected to the electronic components.