There is described a method of assessing an ink deposition accuracy in an electronic device printing process. The method generally has: printing a meta material structure on a substrate using conductive ink, the metamaterial structure having a pattern of conductive elements interspersed with complementary insulating elements, the metamaterial structure having at least a terahertz resonance frequency; emitting a terahertz radiation beam incident on the metamaterial structure of the substrate, the incident terahertz radiation beam having power at least at the terahertz resonance frequency of the metamaterial structure; the metamaterial structure interacting with said incident terahertz radiation beam resulting in an outgoing terahertz radiation beam having a spectral response at least at the terahertz resonance frequency; measuring said spectral response of said outgoing terahertz radiation beam; assessing an ink deposition accuracy of said printing based on said measured spectral response; and generating a signal based on said assessed ink deposition accuracy.

A conductive pattern production device includes: a patterning unit that forms a pattern of a composite ink on a base member; and a burning unit that burns the pattern by high-frequency heating. The composite ink is obtained by mixing a particle material that is a material having a relative permeability of 200 or above or a carbon micro-coil and a conductive ink that has, after the burning, a resistivity of 1 to 2000 .Math.cm.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.

Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.