A self-healing conductive structure includes a conductive layer and a self-healing layer on at least one surface of the conductive layer. The self-healing layer includes a substrate and carbon nanotubes in the insulating matrix, the layer having low viscosity at higher temperatures. When there is a crack in the conductive layer, the self-healing layer flows into the crack, and the carbon nanotubes then in the crack are rearranged under an electric field to repair conductivity. Service life of the conductive structure is improved and signals generated by the conductive structure retain integrity. A method for making the self-healing conductive structure is also provided.

A self-healing conductive structure includes a conductive layer and a self-healing layer on at least one surface of the conductive layer. The self-healing layer includes a substrate and carbon nanotubes in the insulating matrix, the layer having low viscosity at higher temperatures. When there is a crack in the conductive layer, the self-healing layer flows into the crack, and the carbon nanotubes then in the crack are rearranged under an electric field to repair conductivity. Service life of the conductive structure is improved and signals generated by the conductive structure retain integrity. A method for making the self-healing conductive structure is also provided.

A device for inserting a flexible printed circuit board into a connector of a display panel includes: a suction unit configured to adhere to the flexible printed circuit board; a position restriction unit configured to restrict a position of the flexible printed circuit board; and a flexible printed circuit board transfer unit coupled to the suction unit and the position restriction unit, and configured to insert the flexible printed circuit board into the connector. A method of inserting a flexible printed circuit board into a connector of a display panel is also disclosed.

A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules. The protective material conformally covering the top of the electronic modules is heated to a second temperature to solidify the protective material conformally covering the top of the electronic modules to form a protective film conformally covering the top of the electronic modules.

A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.

A self-healing wire includes, an electric wire arranged on a substrate, and a hybrid structure in which the electric wire is covered with at least one fluid selected from the group consisting of a fluid having conductive particles dispersed therein and a fluid having metal ions dissolved therein, formed on a healing portion for a crack to be generated in the electric wire. And a stretchable device includes the self-healing wire formed on a stretchable base material and an electric element mounted only on a base material higher in rigidity than the stretchable base material. Even when a crack is generated in the electric wire due to stretching of the substrate having flexibility, the crack is bridged by the conductive particles or a solid metal deposited from the metal ions in the fluid. Thus the self-healing wire and the stretchable device having both high conductivity and high stretchability are provided.

The present application provides a conductive structure body precursor, a conductive structure body and a method for manufacturing the same.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.

A variable stiffness film, a variable stiffness flexible display, and a manufacturing method thereof may include a lower electrode, a variable fluid, and an upper electrode. A polymer layer may be formed on the lower electrode, and a variable fluid receiving portion is patterned on the polymer layer. A variable stiffness layer is formed by putting a variable fluid in the variable fluid receiving portion. The upper electrode is formed on the variable fluid layer.