Methods for fabricating flexible/stretchable circuits can include identifying one or more regions of a printed circuit board (PCB) for selectively removing insulation material. The PCB can include one or more electrically conductive structures arranged on an insulation layer. The method can include applying, within each region of the one or more regions, thermal energy via a heat source to a surface of the PCB within the region such that insulation material of the insulation layer is removed from the region while a portion of the insulation layer beneath the one or more electrically conductive structures is maintained. The flexible/stretchable circuit can be laminated on a soft actuator to form a soft robotic device.

A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of a surface of which on a side distant from the substrate is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers at least a part of a surface of the sealing resin on the side distant from the substrate. The shield film includes a first shield portion superimposed on at least a part of the first conductive film and a second shield portion. The first shield portion is isolated from the second shield portion by a groove that divides the shield film and is provided to such a depth as entering the sealing resin. The first shield portion is electrically independent.

A display device according to some exemplary embodiment includes: a display area; a non-display area surrounding the display area and including a sealing area; a first substrate including a center portion including a portion in the display area and an external portion including a portion in the sealing area; a second substrate including a center portion including a portion in the display area and an external portion including a portion in the sealing area; and a sealing portion between the first substrate and the second substrate and in the sealing area, wherein a thickness of the center portion of the first substrate is different from a thickness of the external portion of the first substrate, and a thickness of the center portion of the second substrate is different from a thickness of the external portion of the second substrate.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

A process for manufacturing an electrically conducting device from lignocellulosic material comprises the following steps: impregnating (S10) the lignocellulosic material with at least one filling compound so as to produce a composite substrate; and depositing (S12) at least one conducting layer on at least one surface of the composite substrate so as to produce an electrically conducting device.
Use of an electrically conducting device so produced for example particularly as a touch interface.

A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a microwave structure embedded at least partially in the stack. The microwave structure configured for exciting a microwave propagation mode and having at least two stack pieces being interconnected with each other at an electrically conductive connection interface.

A circuit module may include a circuit board and an overmold. The circuit board may have a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may be characterized by a width across the circuit board. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the circuit board. The overmold may at least partially encapsulate the first surface of the circuit board and the second surface of the circuit board. The overmold may extend laterally beyond the width of the circuit board along a length of the circuit board. The overmold may define a region about the tie-bar residual characterized by a first recessed height with respect to the first surface and a second recessed height with respect to the second surface. The overmold may define a notch within the region recessed from an outer edge of the overmold.

According to the present disclosure, a support structure for lighting devices, e.g. LED lighting devices, is provided with an electrically insulating core layer having a first and a second mutually opposed surfaces, with mounting locations for electrically-powered light radiation sources on the first surface, a network of electrically conductive lines printed on said first surface, at least some of said electrically conductive lines extending between the mounting locations and fixed locations on the first surface, and electrical distribution lines of electrically conductive material on the second surface of the core layer, and electrically conductive vias extending through core layer and electrically coupling the electrical distribution lines on the second surface with the electrically conductive lines at said fixed locations on the first surface.

A method for manufacturing a wiring board includes forming on a first support plate a first laminated wiring portion including conductor and insulating layers such that the first portion has a first surface on first support plate side and a second surface, separating the first portion from the first plate, forming a conductor layer exposed on the first surface and including pads, laminating the first portion on a second support plate such that the second surface of the first portion faces second support plate side, forming on the first surface of the first portion a second laminated wiring portion including conductor and insulating layers such that the second portion has a third surface on second support plate side and a fourth surface, forming cavity in the second portion on the second plate such that the cavity exposes the pads, and separating the first and second portions from the second plate.