Disclosed are examples for printing a one-dimensional (1D) nanomaterial for use in stretchable electronic devices. An ink comprising a nanomaterial solution is dispersed from a pneumatic dispensing system of a printing device. The 1D nanomaterial is printed in a predefined pattern on an underlying substrate positioned on a ground electrode. A voltage is applied between the printing nozzle and the ground electrode to cause the ink to form into a cone during the printing. The substrate can be modified to increase the wettability of the substrate to enhance adhesion of the ink to the substrate.

This application relates to an apparatus and method for manufacturing a transparent electrode. One surface of a base substrate is surface-treated with a predetermined material or predetermined light. A conductive material and a hydrophilic solution are sprayed onto the surface-processed base substrate by using a spray block including a spray nozzle and a thermographic camera. The conductive solution is sprayed onto the processed base substrate to form a surface heating body. The surface heating body is heated to be photographed by the thermographic camera. A controller analyzes a photographed image to define an area of supplementation and form a supplemented surface heating body in the area of supplementation by using the spray nozzle, and thus a transparent electrode having uniform heating characteristics is manufactured.

A method for modifying an elongate structure including providing a fluid deposited onto the substrate, the fluid containing a dispersion of electrically polarizable nanoparticles and applying an AC voltage across a portion of the elongate structure so as to cause an alternating electric current to pass through the narrow section such that a break in the elongate structure is formed at the narrow section, the break being defined between a first broken end and a second broken end of the elongate structure, and then cause, when the break is formed, an alternating electric field to be applied to the fluid such that a plurality of the nanoparticles contained in the fluid are assembled to form a continuation of the elongate structure extending from the first broken end towards the second broken end so as to join the first and second broken ends.

Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

A method for modifying an elongate structure including providing a fluid deposited onto the substrate, the fluid containing a dispersion of electrically polarizable nanoparticles and applying an AC voltage across a portion of the elongate structure so as to cause an alternating electric current to pass through the narrow section such that a break in the elongate structure is formed at the narrow section, the break being defined between a first broken end and a second broken end of the elongate structure, and then cause, when the break is formed, an alternating electric field to be applied to the fluid such that a plurality of the nanoparticles contained in the fluid are assembled to form a continuation of the elongate structure extending from the first broken end towards the second broken end so as to join the first and second broken ends.

A multilayer printed circuit board (PCB) includes a laminate between a first core and a second core. The first core is located in a middle position of the multi-layer PCB and includes a resistive heating element directly upon a first core substrate. A portion of the resistive heating element protrudes from the multi-layer PCB perimeter. A laminator that fabricates the PCB includes a platen, a power supply, a processor, and memory that has program instructions embodied therewith which are readable by the processor to cause the laminator to position the platen against a surface of the multi-layer PCB and cure the laminate by heating the multi-layer PCB with the platen and cure the laminate by heating the multi-layer PCB with the resistive heating element.

Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.

An interposer board having heating function and an electronic device using the same are provided. The interposer board includes an insulating body, a plurality of top conductive contacts, a plurality of bottom conductive contacts, a plurality of conductive connection structures and a plurality of micro heaters. The top conductive contacts are disposed on the insulating body. The bottom conductive contacts are disposed on the insulating body. The conductive connection structures are disposed on the insulating body, and the conductive connection structures respectively electrically connected to the top conductive contacts and respectively electrically connected to the bottom conductive contacts. The micro heaters are disposed on or in the insulating body, and the micro heaters are respectively adjacent to the top conductive contacts and the bottom conductive contacts. Each of the top conductive contacts or each of the bottom conductive contacts can be heated by the corresponding micro heater.

A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.

A method for repairing a through-hole includes inserting a repair coil, comprising a tightly-wound repair strip, into a through-hole and inserting a heating element into the repair coil. Passing an electrical current through the heating element liquefies a bonding material disposed on the repair coil and the repair coil expands within the through-hole. Subsequently solidifying the bonding material bonds the repair coil to the through-hole. A repair assembly comprises a repair coil inserted into a through-hole and a heating element inserted into the repair coil. The repair coil comprises a tightly-wound repair strip. The heating element comprises a segment of a heating wire enclosed within an insulating material. Passing an electric current through the segment of the heating wire liquefies bonding material disposed on the repair coil and the repair coil expands within the through-hole. The liquified bonding material solidifies to bond the repair coil to the through-hole.