A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.

A printed circuit board comprises a base material containing at least one conductor path and at least one heat-conducting path forming a heating layer embedded in the base material for generating and conducting heat. The circuit board is characterized in that the heat-conducting path comprises a PTC thermistor with a constant voltage applied thereto. The invention further relates to a plug-in module comprising such a circuit board, and additionally to a field device comprising such a circuit board and/or such a plug-in module.

A flexible display apparatus includes a flexible substrate; a display layer on the flexible substrate and including a plurality of pixels; a cover layer which covers the display layer; a heating electrode layer on a surface of the flexible substrate opposite to the display layer, between the flexible substrate and the display layer, between the display layer and the cover layer, or on a surface of the cover layer opposite to the display layer; and a temperature sensing unit configured to sense an external temperature to the flexible display apparatus.

A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

A positive temperature coefficient (PTC) heater is disclosed. In an embodiment the PTC heater includes a main body having a length L, a width B, and a height H made of a PTC material and a first electrode and a second electrode made of an electrically conductive material, wherein the following is true for L, B, and H: LBH, and wherein the electrodes are connected to the main body so that the following is true for a spacing d thereof from one another: d>H.

The discussion relates to thermal management. One example can include a circuit board including inner, intermediate, and outer generally concentric zones and a cryogenically cooled chip located in the inner zone as well as non-cryogenic electronic components positioned in the outer zone. In this example, the intermediate zone can have a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.