Exemplary embodiments of the invention include a method and apparatus for assembling a semiconductor device. The method may include heating the semiconductor device, which comprises a printed circuit card and a packaging laminate, according to a device heating profile to melt solder material located between an array of contact points on the printed circuit card and an array of corresponding contact points on the packaging laminate; and cooling the semiconductor device to solidify the solder material, wherein during at least a portion of the cooling a temperature of the printed circuit card is kept at substantially a same temperature or a higher temperature than a temperature of an electronic module attached to the packaging laminate opposite the corresponding array of contact points.

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

A power supply device includes a first circuit board, a second circuit, and a plurality of circuit board coupling members. Each of the circuit board coupling members includes a body portion, a first protruding portion, and a second protruding portion. The body portion determines positions of the first circuit board and the second circuit board. The first protruding portion positions the body portion relative to the first circuit board. The second protruding portion positions the body portion relative to the second circuit board. A plurality of first positioning holes in which the first protruding portions are fitted is formed in the first circuit board. A plurality of second positioning holes in which the second protruding portions are fitted is formed in the second circuit board.

A reflow soldering oven for soldering an electronic circuit board, the reflow soldering oven comprising: a first temperature control chamber for applying a first temperature profile to the electronic circuit board; a second temperature control chamber for applying a second temperature profile to the electronic circuit board; a vacuum system comprising a vacuum pump and a vacuum chamber for removing voids in a solder on the electronic circuit board, wherein the vacuum chamber is positioned intermediate the first temperature control chamber and the second temperature control chamber and is fluidly connected to the vacuum pump; and a gas purification system for purifying gas that contains flux components vaporized from the electronic circuit board.

An example method of flattening a circuit board assembly includes attaching the circuit board assembly to a structure having dimensions that partly enclose a space, where attachment of the circuit board assembly to the structure creates an air-tight seal over the space, and where the structure has at least one port in fluid communication with the space. The method also includes applying vacuum pressure to the space via the at least one port, where the vacuum pressure forces at least part of the circuit board assembly toward the space, and dispensing thermal interface material selectively onto parts of the circuit board assembly while the vacuum pressure is applied.