A method and system for manufacturing a workpiece is disclosed. The method comprises providing (810) a layer (120) of a polymeric material on at least a portion of a substrate (110) and patterning (830) the layer of polymeric material by exposing the layer with electromagnetic radiation having a frequency and amplitude within said certain frequency range and amplitude range so as to form a pattern of regions (122) having a first electrical conductivity and regions (124) having a second electrical conductivity. The method further includes the actions of mounting (840) an electronic component (140) on the layer of polymeric material and curing (850) the polymeric material. A workpiece comprising a substrate (110), a layer (120) of a polymeric material adapted to, in a non-cured state, to change its electrical conductivity when exposed with electromagnetic radiation (E) within a certain frequency and amplitude range is also disclosed.

The present invention is to provide a metal particle dispersion for electroconductive substrates, which has high dispersibility and dispersion stability and which is able to form a film that shows high electroconductivity after baking. Disclosed is a metal particle dispersion for electroconductive substrates, comprising metal particles, a dispersant and a solvent, wherein the dispersant is a graft copolymer having at least a constitutional unit represented by the following chemical formula (I) and a constitutional unit represented by the following chemical formula (II): ##STR00001##
(Symbols in the formulae are as described in the Description.)

A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

Controlling dimensions of nanowires includes lithographically forming a trench in a layer of a polymer resin with a width less than one micrometer where the polymer resin has a thickness less than one micrometer and is deposited over an electrically conductive substrate, depositing a nanowire material within the trench to form a nanowire, and obtaining the nanowire from the trench with a removal mechanism.

A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

Controlling dimensions of nanowires includes lithographically forming a trench in a layer of a polymer resin with a width less than one micrometer where the polymer resin has a thickness less than one micrometer and is deposited over an electrically conductive substrate, depositing a nanowire material within the trench to form a nanowire, and obtaining the nanowire from the trench with a removal mechanism.

A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

A method for processing a transparent substrate includes generating at least one laser pulse having laser parameters selected for non-ablatively changing a conductive layer disposed on the transparent substrate into a non-conductive feature, and directing the pulse to said conductive layer. A protective film may be affixed to a surface of the transparent substrate and need not be removed during the processing of the substrate. After processing, processed areas can be visually indistinguishable from unprocessed areas.

A circuit board structure includes a build-up structure, a graphene layer disposed on the build-up structure, and at least one conductive pillar disposed on the graphene layer, the graphene layer includes an oxidized area not covered by the at least one conductive pillar and a non-oxidized area covered by the at least one conductive pillar, and the at least one conductive pillar is electrically connected to the build-up structure via the non-oxidized area.