A special electric component, such as a motor, an accumulator, or an electric subassembly, having at least one soldering pin for solder-joining the special electric component to a printed circuit board. The soldering pin has a connection end that comprises a front section at a free end of the soldering pin and a first section adjacent the front section. The front section has a width that is smaller than the width of the first section. A printed circuit board assembly and an electric device comprising at least one special electric component.

The invention relates to an optoelectronic assembly with an optoelectronic component with two or more connecting contacts for feeding supply and/or control signals. A housing with a two-dimensional structured underside has two or more solder pads which are each surrounded by a non-wettable region, wherein the solder pads are guided through the underside of the housing and are connected to the plurality of connecting contacts. Furthermore, the underside of the housing comprises two or more solder surfaces which are each surrounded by a non-wettable region. The two or more solder pads and the solder surfaces are thereby substantially uniformly distributed over the underside of the housing.

[Problem] Provided is a composite member which can contribute to simple formation and/or increased quality of fine wiring. [Solution] A composite member 100 according to one embodiment of the present invention includes a base material, an aliphatic polycarbonate-containing layer with multiple island-shaped portions arranged on the base material, and a metal ink, wherein at least a surface of the aliphatic polycarbonate-containing layer with multiple island-shaped portions has a contact angle of 50 or more between pure water and the surface when exposed to ultraviolet light including a wavelength of 180 nm or more and 370 nm or less for 15 minutes, and the metal ink is arranged on the base material at at least a portion of a region sandwiched by the precursor layers.

An electronic device may include flexible printed circuits. A flexible printed circuit may have metal traces supported by a polymer substrate. The flexible printed circuit may extend between an upper laptop computer housing and a lower laptop computer housing or other structures that move relative to each other in an electronic device. The flexible printed circuit may have a low-friction coating and a matte finish. The flexible printed circuit may have a fluoropolymer coating on the polymer substrate, a fluoropolymer coating on a matte coating on the polymer substrate, a fluoropolymer coating that includes a matting agent on the polymer substrate, a fluoropolymer layer or other polymer layer that is attached to the substrate with a layer of adhesive, a textured surface layer, and/or other structures that help provide the flexible printed circuit with desired physical properties and a desired appearance.

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

The invention relates to a waterproof device and its electroconductive methods. The waterproof device comprises a body and a coating layer that cover a part or all of surface of the body. The coating layer comprises a recoverable deformation and non-electroconductive material or a material capable of generating quantum-tunnelling electrons. The thickness of the coating layer is more than 30 nm. Furthermore, the electroconductive methods include a contacting electroconductive method.

The invention includes methods of forming electronic circuitry on a target surface using intense pulsed light-induced mass transfer (IPLMT) of metal nanoparticles (NPs) by applying a pliable mask to a target surface, coating a carrier film with metal NPs, mounting the carrier film to the target surface and over the pliable mask so that the pliable mask is sandwiched between the target surface and the metal NPs. and exposing the metal NPs to light energy to cause atoms of the metal NPs to evaporate and transport through openings of the pliable mask and condense on the target surface, producing a conductive pattern of condensed metal on the target surface. Certain implementations may utilize a kirigami-patterned pliable mask to enhance conformity to a freeform 3D target surface. In certain implementations, zinc (Zn) may be formed by IPLMT of Zn NPs to the target surface.

Disclosed is a method for printing a silver nanowire harness network structure by using a glue dispenser, including the following: 1) constructing an induced PET substrate: modifying a PET substrate by a surface hydrophobic treatment method to enhance the binding force between nanowires and the PET substrate and enhance the conductivity of a nanowire network structure; 2) constructing a glue dispensing printing system and printing the nanowire harness network structure: fixing the glue dispenser to a worktable, fixing a printed PET substrate to a ufab three-dimensional moving platform for controlling the movement of the PET substrate, adjusting the moving speed of the ufab three-dimensional moving platform and the distance between a needle head and the PET substrate, controlling the glue dispensing air pressure and the glue dispensing amount of silver nanowire glue by the glue dispenser, and obtaining the nanowire harness network structure on the PET substrate.

A wiring board and a method for manufacturing the same enabling simple and easy formation of a conductive pattern are provided. The method comprises a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a higher surface free energy than the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing to obtain a base material to which the surface free energy difference pattern is transferred; and a conductive pattern forming step of applying a conductive coating composition onto a surface of pattern transfer of the base material to form a conductive pattern.

A miniature technological structure is fabricated by printing a conductive ink in a highly precise pattern onto a substrate. In one embodiment, high-resolution printing of the conductive ink is achieved by precisely patterning a hydrophobic, ink-repellant layer onto a print-receptive surface on the substrate. A water-based, conductive ink is then broadly applied to the substrate, with the ink adhering to the exposed print-receptive surfaces on the substrate and repelling from the ink-repellant layer. In this manner, the ink-repellant layer functions as mask which defines the pattern of the conductive ink retained on the substrate. Because the hydrophobic, ink-repellant layer can be printed with relatively great precision, nanoscale structures can be achieved. In lieu of applying a separate hydrophobic layer onto the substrate, hydrophobicity can be imparted onto an otherwise ink-receptive surface in the desired masking pattern, for example, by roughening the physical texture of the surface.