The present disclosure describes a storage device including a top panel, a bottom panel, a back panel, a front panel, and two side panels configured to form an enclosed volume. The storage device further includes multiple slots disposed at inner surfaces of the two side panels and configured to hold a substrate, a gas diffuser disposed at an inner surface of the back panel and configured to provide a purge gas to the enclosed volume, an isolation gas device disposed on an inner surface of the top panel and adjacent to a top portion of the front panel, and an isolation gas line configured to connect the isolation gas device to the gas diffuser. The isolation gas device is configured to inject the purge gas into a front portion of the storage device and in a direction from the top panel toward the bottom panel.

There is provided an apparatus comprising: a base substrate and a component substrate having at least two electronic components arranged thereon. At least one aperture is formed through an entire thickness of the component substrate. The at least one aperture is formed in an interspace between the at least two electronic components. The component substrate is coupled to the base substrate using a solder joint. Each of the at least two electronic components may comprise a light emitting diode element. A method of manufacturing an apparatus is also disclosed.

A surface-mounted integrated circuit (IC) package is disclosed that has unwanted flux removed from surface-mounted IC. A bottom termination component (BTC) includes lands and a thermal pad. The lands provide an electrical connection from the BTC and the thermal pad provides heat transfer from the BTC. The thermal pad includes vias that are configured to remove flux generated from solder applied to the surface-mounted IC as the surface-mounted IC is assembled. A printed circuit board (PCB) is mourned to the BTC and is electrically connected to the BTC via the lands and receives heat transfer from the BTC via the thermal pad and includes a reservoir. The reservoir is configured to pull flux positioned between the lands into the reservoir as the flux is generated from the solder applied to the surface-mounted IC as the BTC is mounted to the PCB and as the surface-mounted IC is assembled.

A multilayer substrate includes a stacked body including a plurality of insulating base material layers stacked on each other and a plurality of conductor patterns provided in contact with the plurality of insulating base material layers. The stacked body includes a first surface, and the plurality of conductor patterns include a plurality of mounting electrodes. The plurality of mounting electrodes include first openings. The first openings, in a plan view of a mounting surface, are provided over a mounting region and a non-mounting region of the mounting electrodes. The mounting region, when a mounted component is mounted, overlaps with the mounted component, and the non-mounting region does not overlap with the mounted component.

A method for producing an electric circuit in which a contact carrier comprising a first contact area and a second contact area is provided. An insulating body is applied to the circuit carrier and at least partially covers the first contact area and the second contact area. The insulating body comprises cut-outs in regions both contact areas. A flowable electrical conducting medium is introduced into the insulating body.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.

A wiring substrate includes: a first insulating layer; a plurality of wiring patterns formed on one surface of the first insulating layer; a dummy pattern formed, on the one surface of the first insulating layer, between the nearby wiring patterns; and a second insulating layer made of resin and formed on the one surface of the first insulating layer so as to cover the nearby wiring patterns and the dummy pattern, wherein the dummy pattern is a dot pattern arranged at a center portion between the nearby wiring patterns, and wherein a height of at least one dot constituting the dummy pattern is lower than heights of the nearby wiring patterns.

The invention relates to a process to connect, by soldering, at least one electronic component (104, 204, 304, 404, 504) with a mounting plate (100, 200, 300, 400, 500), the mounting plate having at least one mounting plate contact surface (102, 202, 302, 402, 502) and the at least one electronic component having at least one component contact surface (105) corresponding to it, the at least one mounting plate contact surface being surrounded by a solder resist layer (101, 201, 301, 401, 501) that borders the at least one mounting plate contact surface, the process having the following steps: a) Applying solder paste (106, 206, 306, 406, 506) onto at least areas of the solder resist layer (101, 201, 301, 401, 501), minimally overlapping with the mounting plate contact surface (102, 202, 302, 402, 502) adjacent to the solder resist layer, b) Equipping the mounting plate with the at least one electronic component (104, 204, 304, 404, 504), the at least one component contact surface (105) at least partly covering the at least one mounting plate contact surface (102, 202, 302, 402, 502) corresponding to it; and c) Heating the solder paste (106, 206, 306, 406, 506) to produce a soldered connection between the mounting plate and the at least one component.

A plated hole with a sidewall plating. The plated hole has a vent opening that has a sidewall of non-conductive material that is not plated. During attachment of a joint conductive material such as solder to the sidewall plating, gasses generated from the attachment process are outgassed through the vent opening.