A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a signal line and a ground conductor overlapping the signal line as viewed from a laminating direction of the insulating resin base material layers. A plurality of openings are provided in the ground conductor, and an aperture ratio is higher in a zone far from the signal line than in a zone adjacent to or in a vicinity of the signal line in a direction perpendicular or substantially perpendicular to the laminating direction.

A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a plurality of signal lines provided at positions not overlapping each other as viewed from a laminating direction of the insulating resin base material layers, and a ground conductor overlapping the plurality of the signal lines as viewed from the laminating direction. Openings are provided in the ground conductor and, as viewed from the laminating direction, an aperture ratio is higher in an inner zone that is sandwiched between two signal lines than in an outer zone of the two signal lines.

A surface-mounted integrated circuit (IC) package is disclosed that has unwanted flux removed from surface-mounted IC. A bottom termination component (BTC) includes lands and a thermal pad. The lands provide an electrical connection from the BTC and the thermal pad provides heat transfer from the BTC. The thermal pad includes vias that are configured to remove flux generated from solder applied to the surface-mounted IC as the surface-mounted IC is assembled. A printed circuit board (PCB) is mourned to the BTC and is electrically connected to the BTC via the lands and receives heat transfer from the BTC via the thermal pad and includes a reservoir. The reservoir is configured to pull flux positioned between the lands into the reservoir as the flux is generated from the solder applied to the surface-mounted IC as the BTC is mounted to the PCB and as the surface-mounted IC is assembled.

An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.

A wiring board includes an insulating layer, and a metal layer, formed on the insulating layer, and including a first pattern that includes a plurality of wirings extending parallel to each other, and a second pattern that includes a degassing hole. The insulating layer includes a groove exposed between the plurality of wirings, and a surface of the insulating layer inside the degassing hole is located above a bottom surface of the groove.

A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.

A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.

A display device includes a first substrate, a flexible printed circuit, and a film. The flexible printed circuit is disposed on a first area of the first substrate. The film is disposed on the first substrate and the flexible printed circuit. The flexible printed circuit includes a second substrate, a pad area, and a dummy pad. The pad area comprises pads disposed on the second substrate. The pads extend in a first direction and are spaced apart from one another in a second direction crossing the first direction. The dummy pad is disposed on the second substrate. The dummy pad is spaced apart from the pad area.

A fusible via is disclosed. The fusible via includes an upper contact. The fusible via further includes a handle portion having a first end and a second end. The upper contact is disposed on the first end of the handle portion. The handle portion comprises an alloy and a blowing agent. The alloy melts above a predefined solder reflow temperature but below a thermal degradation temperature of the blowing agent. The fusible via further includes a lower contact disposed on the second end of the handle portion.

Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.