A printed wiring board includes a first circuit substrate having first and second surfaces, and a second circuit substrate having third and fourth surfaces such that the first substrate is laminated on the third surface and that the first and third surfaces are opposing each other. The second substrate includes a conductor layer, a first insulating layer including reinforcing material and formed on the conductor layer, and mounting via conductors formed in the first insulating layer and connected to the conductor layer such that the second substrate has a mounting area on the third surface and that the mounting via conductors have via bottoms forming pads positioned to mount an electronic component in the mounting area, and the first substrate includes an insulating layer which does not contain reinforcing material and has an opening through the insulating layer and exposing the via bottoms forming the pads in the mounting area.

A display device and a manufacturing method thereof are provided. The display device includes a display panel, a circuit board, and a conductive adhesive member. The display panel includes a display area and a non-display area adjacent to the display area. The circuit board overlaps the non-display area and is connected to the display panel. The conductive adhesive member is between and electrically connects the circuit board and the display panel. The circuit board includes: a base layer including a pad area; circuit pads overlapping the pad area and on the base layer, the circuit pads being spaced apart in a plan view and arranged in a direction; and a first resin layer overlapping the pad area and on the base layer. In a plan view, the first resin layer overlaps an area between two adjacent circuit pads and covers side surfaces of the two adjacent circuit pads facing in the direction.

An interconnect element 130 can include a dielectric layer 116 having a top face 116b and a bottom face 116a remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces 132, 134. A plurality of conductive protrusions 112 can extend upwardly from the plane defined by the first metal layer 102 through the dielectric layer 116. The conductive protrusions 112 can have top surfaces 126 at a first height 115 above the first metal layer 132 which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias 128 can extend from the top surfaces 126 of the protrusions 112 to connect the protrusions 112 with the second metal layer.

An electrical terminal for electrically connecting a cable to an electrical circuit, especially an antenna, disposed on a thin support comprising a connection part that includes a center-pin, and a surrounding metallic ring and a base part that includes a dielectric substrate having a top surface and a bottom surface, a ring metallic pad electrically connected to the surrounding metallic ring, and a pin metallic pad electrically connected to the center-pin and electrically isolated from the ring metallic pad; the ring metallic pad and the pin metallic pad being disposed on the bottom surface; the connection part being disposed on the top surface of the base part and extending substantially perpendicular to the top surface. The base part further comprises a ring penetration means designed to penetrate through the thin support. The dielectric substrate and the ring penetration means are not coplanar.

A flexible printed circuit board includes a base film, a wiring layer disposed on the base film and a plurality of conductive balls partially embedded in the upper surface of the wiring layer. A display device includes a display panel including a display area and a peripheral area, a flexible printed circuit board facing and bonded to a pad portion disposed in the peripheral area and a nonconductive film disposed between the pad portion and the flexible printed circuit board, wherein the flexible printed circuit board includes a plurality of conductive balls partially embedded on an upper surface of a wiring layer disposed on a base film, and the pad portion has a portion that comes into contact with the plurality of conductive balls.

Proposed are a flexible die-cut circuit board including a substrate made of a flexible material, the substrate having a first surface and a second surface opposite to the first surface, at least one trace formed on the first surface of the substrate, a pattern fuse formed as a portion of the trace, the pattern fuse having a smaller thickness than other portions of the trace and being configured to break when excessive current flows, and a protective layer configured to cover the trace and the pattern fuse, wherein the pattern fuse is formed in a pattern having a curved shape in a direction perpendicular to the first surface of the substrate, and a method of manufacturing the same.