A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.

High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

Provided is a method of fabricating an electronic circuit including providing a copper ion solution. The copper ion solution includes a source of copper (II) ions, L-ascorbic acid, and water. The copper ion solution is applied on a substrate to form a coating layer. A heat source is provided to locally heat the coating layer to react copper ions in the coating layer to form copper conductive patterns.

A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of a AgCu eutectic structure layer (32) is set to 15 m or less.

A glass circuit board includes, on a glass substrate, a stress relief layer, a seed layer, and an electroplated layer including copper plating. The stress relief layer is an insulator formed by dry coating method and applies a compressive residual stress to the glass substrate at room temperature. The stress relief layer thus reduces cracking, fracturing or warpage of the glass substrate caused by thermal expansion and shrinkage of the copper plating due to heating and cooling of the glass circuit board during manufacturing or thermal cycling, ensuring high connection reliability of the glass circuit board.

Articles, electronic devices and related methods of fabrication interfacing graphene with a gallium liquid metal alloy.

A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.

Doped, low-temperature co-fired ceramic (LTCC) insulating substrates and related wiring boards and methods of manufacture are disclosed. The doped, LTCC insulating substrate is formed from a baked (e.g., sintered) glass-ceramic aggregate material formed from a glass material, a ceramic filler material, and a composite oxide. The crystallized glass-ceramic aggregate is then doped with Iron and/or Manganese before baking. Iron or Manganese can further reduce dielectric loss and the loss tangent of the LTCC insulating substrate formed from that glass material. The glass material becomes crystallized due to an oxide crystal phase being deposited on the glass material during baking, which reduces the dielectric losses. This may be important for the application use as wiring boards for high radio-frequency (RF) electrical circuits where low dielectric loss and loss tangent is desired to achieve a desired signal transmission delay performance.

Doped, low-temperature co-fired ceramic (LTCC) insulating substrates and related wiring boards and methods of manufacture are disclosed. The doped, LTCC insulating substrate is formed from a baked (e.g., sintered) glass-ceramic aggregate material formed from a glass material, a ceramic filler material, and a composite oxide. The crystallized glass-ceramic aggregate is then doped with Iron and/or Manganese before baking. Iron or Manganese can further reduce dielectric loss and the loss tangent of the LTCC insulating substrate formed from that glass material. The glass material becomes crystallized due to an oxide crystal phase being deposited on the glass material during baking, which reduces the dielectric losses. This may be important for the application use as wiring boards for high radio-frequency (RF) electrical circuits where low dielectric loss and loss tangent is desired to achieve a desired signal transmission delay performance.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.