A method for producing an electric circuit in which a contact carrier comprising a first contact area and a second contact area is provided. An insulating body is applied to the circuit carrier and at least partially covers the first contact area and the second contact area. The insulating body comprises cut-outs in regions both contact areas. A flowable electrical conducting medium is introduced into the insulating body.

A method for producing electronic devices includes fixing a die that includes an electronic component with integral contacts to a dielectric substrate. After fixing the die, a conductive trace is printed over both the dielectric substrate and at least one of the integral contacts, so as to create an ohmic connection between the conductive trace on the substrate and the electronic component.

Various embodiments are directed to a method of forming an apparatus including placing a first electronic circuit in contact with a second electronic circuit, wherein each of the first and second electronic circuits have connector circuits configured and arranged to provide an electrical connection between the first and second electronic circuits and are formed with a polymer film that is configured to adhere, via self-healing, to another polymer film. The method further includes, in response to the contact, causing or facilitating the self-healing of the respective polymer films of the first and second electronic circuits, thereby creating the electrical connection therebetween.

A method to remove slugs from a circuitry pattern on the fly during the fabrication of a flexible printed circuit, the method includes applying a coverlay reel-to-reel onto one side of the metal foil on the fly and applying a sacrificial liner reel-to-reel onto another side of the metal foil on the fly. Then, after the slugs and circuitry patterns are created from laser ablation, the slug can be removed by applying compressed air to the slugs and/or peeling off the sacrificial liner from the circuitry pattern reel-to-reel.

A method for manufacturing an electrical conductor includes: depositing a solid metal conductive layer or film on a substrate 30; depositing a liquid metal on the solid layer; and allowing the liquid metal and the solid layer 40 to alloy by diffusion of the liquid metal into the solid layer or film so as to form a solid conductive layer or film of the alloy; as well as allowing the liquid metal to further infiltrate the alloy so as to form percolating paths and/or droplets of the liquid metal in the the solid conductive layer or film, thus forming a biphasic conductive layer.

A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase GaIn eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

The present invention comprises a method of manufacturing electronics without PCBs and an apparatus for manufacturing electronics without PCBs.

A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase GaIn eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

Methods, systems, and apparatus for fabricating a circuit board. The method includes fabricating, using an additive manufacturing device, a trace layer, a sacrificial layer, a rail layer and a lid. The method includes placing the sacrificial layer on the trace layer such that the raised traces protrude through corresponding openings of the sacrificial layer. The method includes depositing a conductive material on top of the sacrificial layer and the plurality of traces. The method includes removing the sacrificial layer from the trace layer and placing the rail layer on the trace layer such that the raised traces align with the corresponding openings of the rail layer. The method includes connecting one or more electrical components and melting a sealing sheet on top of the rail layer and the electrical components to reinforce connections and to provide protection. The method includes placing the lid on top of the sealing sheet.

Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature sintering process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.