A liquid metal-based flexible electron device and a preparation method are disclosed. In the method, 3D printing and the characteristic that ABS plastic can be dissolved by acetone are utilized, and a microchannel is quickly constructed in the flexible substrate of Ecoflex, and liquid metal is then injected into the microchannel to complete the manufacturing of a flexible electronic device. The gold film on the surface of ABS is transferred to the surface of the flexible Ecoflex substrate.

An example sensor includes a PCB mounted in an internal chamber of housing, wherein the PCB comprises calibration electrical contact points; a sealing grommet mounted in the internal chamber, wherein the sealing grommet comprises an axial hole aligned with the calibration electrical contact points, thereby providing access to the calibration electrical contact points of the PCB; a grommet plug disposed in the axial hole of the sealing grommet; a sensing element disposed in the housing and electrically-coupled to the PCB via an electrical connection; an encapsulant sealing material deposited on the sealing grommet and the grommet plug; and an external cable connected to the PCB and extending through the sealing grommet and through the encapsulant sealing material.

An embodiment of the invention may include a method, and resulting structure, of forming a semiconductor structure. The method may include forming a component hole from a first surface to a second surface of a base layer. The method may include placing an electrical component in the component hole. The electrical component has a conductive structure on both ends of the electrical component. The electrical component is substantially parallel to the first surface. The method may include forming a laminate layer on the first surface of the base layer, the second surface of the base layer, and between the base layer and the electrical component. The method may include creating a pair of via holes, where the pair of holes align with the conductive structures on both ends of the electrical component. The method may include forming a conductive via in the pair of via holes.

The present disclosure generally relates to an electronic strain sensor, a system incorporating the sensor, and a method of manufacturing the sensor. The present disclosure also relates to methods of measuring one or more physiological parameters of a living subject, or methods of diagnosing a sleep-related disorder of a living subject, the methods comprising sensing a signal produced by the living subject with the electronic strain sensor or system. The strain sensor comprises: an electrode layer printed on a substrate, a sensing layer printed on a portion of the electrode layer, and an encapsulation layer encapsulating the electrode and sensing layers. The electrode layer exhibits a sheet resistance less than that of the sensing layer, and the sensing layer is in direct contact with the electrode layer. The sensor's electrical resistance can be increased through forming microscopic cracks in the sensing layer in response to forces applied to the sensor.

Provided are a polyurethane and a curable composition capable of obtaining an overcoat film for a flexible wiring board that is excellent in low-warpage properties, flexibility, long-term insulation reliability, and wiring disconnection preventing properties. The polyurethane has: a structural unit of formula (1) (in formula (1), an n-number of R.sup.1 each independently represents a 1,2-phenylene group or a 1,2-phenylene group having a substituent, an (n+1)-number of R.sup.2 each independently represents a hydrocarbon group having 3-9 carbon atoms, and n represents an integer from 1 to 50); a structural unit of formula (2) (in formula (2). R.sup.3 represents a divalent organic group having 6-14 carbon atoms); and a structural unit of formula (3) (in formula (3), R.sup.3 represents a divalent organic group having 6-14 carbon atoms, and R.sup.4 represents a methyl or ethyl group). ##STR00001##

According to at least one aspect, a lighting system is provided. The lighting system includes a first lighting device comprising a first light emitting diode (LED), a second lighting device comprising a second LED, a two-part connector configured to electrically couple the first lighting device to the second lighting device and comprising a first connector portion attached to the first lighting device and a second connector portion attached to the second lighting device, at least one elastomer commonly encapsulating the first lighting device, the second lighting device, and the two-part connector, and a cutting device configured to facilitate separation of the first lighting device from the second lighting device at least in part by cutting at least some of the at least one elastomer that is adjacent a surface of the two-part connector.

Object:

A plurality of problems of an electromagnetic wave transmissive cover to be installed in an electromagnetic wave irradiation direction of a sensor using an electromagnetic wave are simultaneously eliminated.

Resolution means:

An electromagnetic wave transmissive cover 1 is a member to be installed in an electromagnetic wave irradiation direction of a millimeter wave radar 100 using an electromagnetic wave, and includes a colored resin member 3, a transparent resin member 5, and a transparent heater film 7. The transparent resin member 5 is provided on an opposite side to the millimeter wave radar 100 of the colored resin member 3. The transparent heater film 7 is provided on the opposite side to the millimeter wave radar 100 of the colored resin member 3, includes a wiring pattern formed by copper plating or etching, and has electromagnetic wave transmissivity.

Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.

A potting cup is provided and is positioned on a printed circuit board. The potting cup encapsulates a portion of the printed circuit board including at least one interface subject to corrosion when exposed to moisture and is configured to receive a potting material in the encapsulated portion to cover the at least one interface subject to corrosion.

A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.