An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

A multilayer structure for a garment, optionally footwear, includes a flexible substrate film for accommodating electronics, a number of flexible sensor pads provided on the film utilizing printed electronics technology, optionally screen printing or ink jetting, at least one electronic circuit, preferably integrated circuit, further provided on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure, a number of conductor traces further printed on the film for electrically connecting the at least one electronic circuit and the number of capacitive sensor pads, a power supply element for powering electricity-driven components including the at least one electronic circuit, and at least one plastic layer molded upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin. A related method of manufacture is presented.

A flexible electrode array with hundreds or thousands channels for clinical use includes an array of at least hundreds of electrodes on a flexible biocompatible polymer substrate. Perfusion through holes are provided through the substrate. Individual elongate leads connect to each of the electrodes, the elongate lead connections being supported by the flexible biocompatible polymer substrate and extending away from the array. Flexible biocompatible polymer insulates the individual elongate lead connections and supporting the array. An interposer with individual channel connections is conductively bonded to the individual elongate lead connections. Sterile bag packaging encloses a portion of the interposer, where the outer side of the package including the array and individual elongate lead is sterile while the inner side of the packaging is non-sterile. The portion interposer inside the package is configured to connect to a circuit board within the packaging.

A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.

Aspects of the present disclosure relate to a lighting device. The lighting device may include a circuit board, a plurality of white light emitting diodes (LEDs) mounted on one side of the circuit board and configured to emit white light at a first color correlated temperature (CCT) value, and a pigmented elastomer comprising a plurality of pigments distributed throughout the elastomer and encapsulating at least the one side of the circuit board. The plurality of pigments may include a red pigment and a yellow pigment and be configured to change a CCT value of the white light emitted by the plurality of LEDs from the first CCT value to a second CCT value that is different from the first CCT value.

An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

An electrical node, a method, an electrical assembly such as a node strip or sheet, a related multilayer structure, and a method of manufacture are presented. The electrical node comprises a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element arranged into the cavity.

Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.

Aspects of the present disclosure relate to a lighting device. The lighting device may include a circuit board, a plurality of white light emitting diodes (LEDs) mounted on one side of the circuit board and configured to emit white light at a first color correlated temperature (CCT) value, and a pigmented elastomer comprising a plurality of pigments distributed throughout the elastomer and encapsulating at least the one side of the circuit board. The plurality of pigments may include a red pigment and a yellow pigment and be configured to change a CCT value of the white light emitted by the plurality of LEDs from the first CCT value to a second CCT value that is different from the first CCT value.

According to at least one aspect, a lighting system is provided. The lighting system includes a first lighting device comprising a first light emitting diode (LED), a second lighting device comprising a second LED, a two-part connector configured to electrically couple the first lighting device to the second lighting device and comprising a first connector portion attached to the first lighting device and a second connector portion attached to the second lighting device, at least one elastomer commonly encapsulating the first lighting device, the second lighting device, and the two-part connector, and a cutting device configured to facilitate separation of the first lighting device from the second lighting device at least in part by cutting at least some of the at least one elastomer that is adjacent a surface of the two-part connector.