A glass member for a display device, a method of fabricating a glass member, and a display device including a glass member are provided. A method of fabricating a glass member for a display device includes: preparing a glass substrate including a first surface, a second surface facing the first surface, and a side surface connecting the first surface to the second surface; forming a protection layer on the side surface to cover a portion of the side surface; and etching a portion of the glass substrate exposed by the protection layer.

Apparatus for transferring conductive patterns to a substrate (56), comprising a module (52) configured to transfer a pattern (63) of sinterable material (63a) to said substrate (56) and an optical module (12) to perform a sintering of the transferred pattern (63a). Said apparatus comprises one or more self-propelled pattern transferring units (52) comprising a module configured to move e said self-propelled unit (14, 20) over said substrate (56) under the control of movement instructions (53b) associated to a motor (16, 21), said self-propelled unit (14, 20) comprising said module (52) configured to transfer a pattern (63a) of sinterable material (CI) to said substrate (56) obtaining a transferred pattern (63a) and comprising also said optical module (12) to perform a sintering of the transferred pattern (63a) on said substrate (56) obtaining a sintered pattern (63b, 63c).

A method of encapsulating a printed circuit board of a motor controller with a potting material includes inserting the printed circuit board into a recess formed in a base portion of an encapsulation assembly such that a bottom surface of the printed circuit board is spaced from a surface of the recess. The method also includes coupling a cover portion of the encapsulation assembly to the base portion to define a cavity therebetween. The method further includes injecting the potting material into the cavity through at least one injection port defined in at least one of the base portion and the cover portion such that the printed circuit board is at least partially coated in the potting material.

A method for manufacturing a waterproof circuit board comprises steps of providing a first wiring substrate suitable for high-frequency transmissions. The first wiring substrate includes a first copper layer and a first conductive wiring layer. A waterproof layer is formed on exposed surfaces of the first wiring substrate. A second wiring substrate suitable for low-frequency transmissions defines a receiving groove. The second wiring substrate includes a second copper layer and defines a first blind hole. The first wiring substrate is pressed in the receiving groove. A first conductive portion is formed in the first blind hole to electrically connect the first conductive wiring layer and the second copper layer.

In a circuit forming device, resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into cavity of the resin laminated body, and electronic component is placed on ultraviolet curable resin. Then, electronic component is cured and electronic component is fixed. In addition, since the ultraviolet curable resin is cured by only irradiating the ultraviolet curable resin with ultraviolet rays, it is possible to reduce the time required for fixing the component. In addition, by causing the ejection amount of the ultraviolet curable resin for fixing the component to correspond with at least one of the size and the weight of the electronic component, it is possible to properly mount the component at a planned mounting position by a self-alignment effect.

A display device includes a display module and a circuit board. The display module includes a base substrate, which includes a display area and a non-display area adjacent to the display area, and a first pad positioned on the base substrate and overlapping the non-display area. The circuit board includes a first board and a second pad positioned on the first board and contacting the first pad, wherein the second pad is provided with a first metal layer of a single material.

A method for manufacturing a conductive circuit board includes the steps of: (a) preparing a substrate having opposite upper and lower surfaces, and at least one through hole extending through the upper and lower surfaces and defined by an inner surface; (b) forming a metal base layer on at least one of the upper and lower surfaces and on the inner surface; (c) etching the metal base layer by a laser beam so that the at least one of the upper and lower surfaces and the inner surface are formed with a patterned metal base layer; and (d) forming a metal circuit layer on the at least one of the upper and lower surfaces and on the inner surface to increase a thickness of the patterned metal base layer. A conductive circuit board manufactured therefrom is also enclosed.

A circuit board includes a substrate including first and second sections with different thicknesses, a protective layer, and mounting electrodes. The substrate includes a step surface connecting a first principal surface of the first section and a first principal surface of the second section. The mounting electrodes are on the first principal surface corresponding to an element to be mounted. The protective layer is disposed over the first principal surface, the step surface, and the first principal surface. The separation distance between the mounting electrode and the step surface is greater than or equal to the terminal-to-terminal distance between the mounting electrode and the mounting electrode.

A flexible printed circuit board (PCB) may have one or more coin cell batteries mounted thereto such that the flexibility of the flexible PCB is maintained. The flexible PCB has one or more battery contact pads fabricated thereon. Each battery contact pad includes a pattern of metalized vias each extending from a top surface to a bottom surface of the flexible PCB. A coin cell battery may be positioned over or under the battery contact pad. Conductive light curable epoxy is applied to and in each metalized via to contact and adhere to the coin cell battery to form a conductive path from the battery through the battery contact pad to printed conductors on the flexible PCB. Methods of mounting one or more coin cell batteries to a flexible PCB are also provided, as are other aspects.

A wiring board may include a core portion having first and second surfaces, and first and second buildup portions on the first and second surfaces, respectively. Each of the first and second buildup portions may include a first insulating layer on the core portion, a wire pattern on the first insulating layer, a second insulating layer on the first insulating layer to cover the wire pattern, and a protection layer covering the second insulating layer and exposing a portion of the wire pattern. The second insulating layer may include a resin layer and inorganic fillers distributed in the resin layer. The fillers may not be provided in the protection layer, and the resin layer of the second insulating layer and the protection layer may be formed of the same material. The wire patterns of the first and second buildup portions may be electrically connected to each other.