Provided are a surface-treated glass cloth that enables the reliability of a printed wiring board to be improved, a prepreg, and a printed wiring board. In the surface-treated glass cloth, a surface-treated layer contains a silane coupling agent, the amount of carbon attached of an adhering component of the surface-treated layer is in the range of 0.030 to 0.060% by mass, the arithmetic average height of the surface of the adhering component of the surface-treated layer is in the range of 1.0 to 3.0 nm, and the product of the amount of carbon attached of the adhering component and the arithmetic average height of the surface of the adhering component is in the range of 0.060 to 0.100.

The proposed masking dam protects ball grid array integrated circuit components from conformal coating overflow, preventing joint breakage and thermal mismatch. The masking dam includes a frame with an integrated seal, a cover, and a fastening mechanism. The frame is sealed to a circuit board surround a component, the cover is attached to the frame, and the masking dam is secured to protect the component.

A glass member for a display device, a method of fabricating a glass member, and a display device including a glass member are provided. A method of fabricating a glass member for a display device includes: preparing a glass substrate including a first surface, a second surface facing the first surface, and a side surface connecting the first surface to the second surface; forming a protection layer on the side surface to cover a portion of the side surface; and etching a portion of the glass substrate exposed by the protection layer.

A display device includes a display module and a circuit board. The display module includes a base substrate, which includes a display area and a non-display area adjacent to the display area, and a first pad positioned on the base substrate and overlapping the non-display area. The circuit board includes a first board and a second pad positioned on the first board and contacting the first pad, wherein the second pad is provided with a first metal layer of a single material.

A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.

An electronic device package includes a semiconductor chip having a contact pad on a main face of the semiconductor chip, a contact element disposed on the contact pad, a dielectric layer disposed on the semiconductor chip and the contact element, and an encapsulant disposed onto the dielectric layer.

Electrically isolating an electrical or electronic assembly having a carrier and one or more electrical or electronic components mechanically and electrically connected with the carrier, includes coating the carrier or at least one of the components or both entirely or partially with powder. The powder includes powder particles of electrically isolating material that have an average particle diameter of less than 1000 micrometers.

A flexible circuit board includes two first wiring boards, a first adhesive, and a first conductive structure. Each of the two first wiring boards includes a first bent portion, and two first bent portions of the two wiring boards is connected to each other. The first adhesive layer is sandwiched between the two first bent portions. The first conductive structure penetrates the two first bent portions and the first adhesive layer and electrically connects the two first bent portions.

A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.

A circuit device includes a circuit substrate, a protective layer and a side trace. The circuit substrate has a first surface, a second surface opposite to the first surface, and a side surface. A first turning region is provided between the first surface and the side surface. A second turning region is provided between the second surface and the side surface. The circuit substrate includes a carrier plate and a first circuit structure. The first circuit structure is located on the carrier plate, and includes a pad located on the first surface. The protective layer at least partially covers the first turning region and the second turning region. A material of the protective layer includes cured silver paste, epoxy resin or an acrylic-based insulating material. The side trace is located on the protective layer, and extends from the pad across the side surface to the second surface.