A component built-in board mounting body has a component built-in board mounted on a mounting board, the component built-in board being configured having stacked therein a plurality of printed wiring bases that each have a wiring pattern and a via formed on/in a resin base thereof, and having an electronic component built in thereto, wherein the component built-in board has at least a portion of the plurality of printed wiring bases including thermal wiring in the wiring pattern and including a thermal via in the via, and is mounted on the mounting board via a bump formed on a surface layer of the component built-in board, and a surface on an opposite side to an electrode formation surface of the built in electronic component is connected to the bump via the thermal via and the thermal wiring, and is thermally connected to the mounting board via the bump.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The physiological sensor is operable to analyze biological fluids such as sweat.

A logic board includes topmost and bottommost layers, a primary trace layer, and first and second secondary trace layer respectively above and below the primary trace. The logic board includes a conductive via extending from the topmost or bottommost layer to the primary trace layer. The logic board includes a backdrilled hole concentric with the conductive via, from the bottommost layer at least to the second secondary trace layer and not reaching the primary trace layer, or from the topmost layer at least to the first secondary trace layer and not reaching the primary trace layer. The logic board includes a primary conductive trace within the primary trace layer and extending from the conductive via. The logic board includes first and second secondary conductive traces respectively within the first and second secondary trace layers and extending from the conductive via.

A substrate structure includes a substrate and a vertical conductive connector. The substrate includes a material with a heat resistance temperature of 300 C. or greater. The vertical conductive connector penetrates through the substrate. The vertical conductive connector has a bonding structure extending toward the substrate. A manufacturing method of the substrate structure is also provided.

A coverlay film includes an insulating film having a first main surface and a second main surface as a surface opposite to the first main surface, an adhesive layer disposed on the first main surface and formed from an uncured adhesive, and a separator disposed on the adhesive layer. The insulating film has a thickness of more than or equal to 2 m and less than or equal to 15 m. The adhesive layer has a thickness of more than or equal to 10 m and less than or equal to 50 m.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

A method for producing a thin wiring member is disclosed. The method includes forming a wiring layer on a first carrier, the wiring layer including a plurality of wiring parts, cutting the wiring layer such that each includes at least one wiring part of the plurality of wiring parts, attaching a second carrier to a second surface on opposite side of a first surface on which the first carrier is provided in the wiring layer, peeling the first carrier from the wiring layer, forming, with laser beam, a modification region to become a starting point of a fracture, in an internal region of the second carrier which corresponds to a site at which the wiring layer has been cut, and expanding the second carrier on which the modification region is formed along a planar direction to divide the second carrier into a plurality of carrier parts.

The layered body includes a seed layer that serves as a base for plating and that can be formed using a simple and low-cost method capable of ensuring stable quality and preventing the occurrence of scratches on the plating seed layer due to contact with a coating apparatus during application and contact with conveyor rollers. The layered body can provide good adhesion between a support and a metal layer (metal plating layer) without roughening the surface of the support. The transfer layered bodies is produced by forming a plating seed layer containing a dispersant and an electrically conductive material on a temporary support, forming a resin layer on the plating seed layer, and then allowing functional groups in the plating seed layer and functional groups in the resin layer to react with each other.

A method for making electrically conductive patterns using a metal particle-free ink containing a catalyst precursor that subsequently forms catalytic seed nanoparticles in-situ during or after a patterning step. The catalytic pattern is fixed on the target substrate after which catalytic sites are generated by reduction of the precursor to metallic particles. The reductant is selected to minimize particle generation under ambient conditions but the reduction of the catalyst precursors in the ink may be accelerated by an external input such as heat or ultraviolet energy. This catalytic pattern is then metallized with electroless plating to generate a conductive metallic pattern corresponding to the first catalyst pattern.

A method for manufacturing a wiring board that includes preparing a substrate including an insulating resin and a metal member having an anti-rust layer formed on a surface thereof that is arranged so as to face a second surface of the insulating resin. The method includes forming a bottomed hole by irradiating a first laser beam from a first surface side of the insulating resin. The bottomed hole penetrates the insulating resin and has an inner bottom surface that is the surface of the metal member. The method also includes removing the anti-rust layer formed on the surface of the metal member in the inner bottom surface of the bottomed hole, injecting a conductive paste into the bottomed hole and applying the conductive paste to the first surface of the insulating resin so as to have a wiring continuous with the injected conductive paste, and curing the conductive paste.