A method for manufacturing a wiring substrate includes forming a conductor layer including first and second pads, forming a resin insulating layer on the conductor layer, forming, in the insulating layer, a first opening exposing the first pad and a second opening exposing the second pad, forming a covering layer on the insulating layer such that the covering layer covers the first and second openings, forming a third opening in the covering layer such that the third opening communicates with the first opening and the first pad is exposed in the third opening, forming, on a surface of the first pad, a protective film formed of material different from material forming the conductor layer, removing the covering layer from the insulating layer, and forming a conductor post on the second pad such that the conductor post is formed of material that is same as the material forming the conductor layer.

A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 μm and a narrowest vertical thickness of the bridge structure is at least 20 μm.

A method for exposing a photopolymerization layer comprising photopolymers includes: providing a printed circuit board, with a photopolymerization layer disposed on the top side of the printed circuit board; performing first-instance exposure on the photopolymerization layer, using a UV source and a digital micro-lens device, wherein the UV source is of a power less than 0.2 kW; stopping the first-instance exposure; covering the photopolymerization layer with a mask, with the mask having a bottom side in contact with the photopolymerization layer; and performing second-instance exposure on the photopolymerization layer, using a mercury lamp and the mask, wherein the mercury lamp is of a power greater than 5 kW.

A coreless component carrier includes (a) a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure; and (b) a component embedded in the stack. At least one electrically insulating layer structure includes a reinforced layer structure, which is arranged at an outer main surface of the stack. Further described is a method for manufacturing such a coreless component carrier and preferably simultaneously a further coreless component carrier of the same type.

A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.

A printing control device includes a determination section, a first printing control section, a movement controller, and a second printing control section. When the determination section determines that an elapsed time in which no board is convey exceeds an allowable time, the first printing control section causes the printer to execute the printing process for a first time on a first board which is conveyed in since the determination is made. The movement controller separates the mask and the board from each other after the first printing control section executes the printing process for the first time and brings the mask and the board into abutment with each other again after the separation. The second printing control section causes the printer to execute the printing process for a second time on the board after the movement controller brings the mask and the board into abutment with each other again.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 μm and not more than 200 μm. The contact angle between the first jutting portion and the first sloped portion is 65° or less.