Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.

In order to remove treatment liquid (21) from a planar material to be treated (10), which is transported in an assembly for the electrolytic or wet-chemical treatment of the material to be treated (10), or to promote the exchange of material on the surface of the material to be treated (10), a roll with a roll surface (4, 14) is provided. The roll surface (4, 14) is arranged relative to a transport path of the material to be treated (10) so that a gap (8, 18) remains between the roll surface (4, 14) and a useful region of the material to be treated (10) opposing the roll surface (4, 14), which extends over the useful region. The roll is driven rotatably so that at the gap (8, 18) a relative speed is produced between the roll surface (4, 14) and the material to be treated (10).

A process apparatus capable of pushing a panel-shaped object includes a process apparatus and at least one panel-shaped object. The process apparatus includes a carrying fixture and a separating fixture. The carrying fixture has a top surface and a bottom surface opposite to each other and has at least one positioning pillar. The separating fixture has a pushing portion. The panel-shaped object has at least one positioning hole and is carried on the top surface. The positioning pillar is inserted into the positioning hole to position the panel-shaped object. The pushing portion is adapted to move from the bottom surface toward the top surface and protrude out of the top surface, such that the panel-shaped object is pushed up by the pushing portion to be separated from the carrying fixture. In addition, a process method adapted to the process apparatus capable of pushing a panel-shaped object is also provided.

A soldering device comprising: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode; and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component.

An apparatus that cleans end surfaces of a substrate includes: a guide unit including a guide portion that has a channel, through which an end surface of a substrate passes, formed in a front surface thereof; and a brush with a front end whose position is controlled by a rear surface of the guide portion. The channel includes an opening that extends through the guide portion and the front end of the brush contacts an end surface of a substrate passing through the channel via the opening. The guide unit includes a concave portion in which at least the front end of the brush is housed and a suction hole that sucks dust from the concave portion.

A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.

A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

Disclosure provides a FPC flattening jig and a FPC flattening method. The FPC flattening jig includes a pressurization mechanism and a heating mechanism; a bottom of the pressurization mechanism has a planar base surface which is used to contact a warped FPC to exert pressure thereon; the heating mechanism is used to heat the pressurization mechanism, such that the planar base surface of the pressurization mechanism has a predefined temperature when exerting pressure on the FPC. The FPC flattening jig heats the pressurization mechanism by a heating mechanism, and then the heated planar base surface of the pressurization mechanism contacts the warped FPC and exerts pressure thereon. Therefore, the FPC can be flattened. As such, the FPC can be reused, facilitating the improvement on the

A soldering device for soldering a printed circuit board includes at least one heating appliance melting solder situated between electrical or electronic components being soldered onto a printed circuit board and the printed circuit board. At least one actuator mechanically oscillates the printed circuit board at a variable frequency of oscillation in a direction of a plane defioned by the printed circuit board. A second lateral edge of the printed circuit board, the second lateral edge being opposite to the first lateral edge of the printed circuit board, rests against iand supported by a fixed stop.