A semi-finished product for the production of connection systems for electronic components comprises two groups (A, B) of alternately applied conductive layers and insulating layers, wherein outer layers (2, 2) of the two groups (A, B) are facing each other to form a separation area for the groups (A, B) to be separated from each other to yield connection systems for electronic components and the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers (4, 4) following the separation area. The method for the production of connection systems for electronic components is characterized by the following steps: a) orienting two groups (A, B) of alternately applied conductive layers and insulating layers (4, 4) to face each other with outer layers to form a separation area for the groups (A, B) to be separated from each other and safeguarding that the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers (4, 4) following the separation area, b) processing the groups (A, B) of alternately applied conductive layers and insulating layer, c) cutting through the separation area along the edges thereof.

A printed wiring board includes a first circuit substrate having first and second surfaces, and a second circuit substrate having third and fourth surfaces such that the first substrate is laminated on the third surface and that the first and third surfaces are opposing each other. The second substrate includes a conductor layer, a first insulating layer including reinforcing material and formed on the conductor layer, and mounting via conductors formed in the first insulating layer and connected to the conductor layer such that the second substrate has a mounting area on the third surface and that the mounting via conductors have via bottoms forming pads positioned to mount an electronic component in the mounting area, and the first substrate includes an insulating layer which does not contain reinforcing material and has an opening through the insulating layer and exposing the via bottoms forming the pads in the mounting area.

The present disclosure relates to a printed circuit board including a first insulating layer including a non-photosensitive insulating material, a first wiring layer embedded in the first insulating layer, where an upper surface thereof is exposed from the upper surface of the first insulating layer, includes a first metal layer, and a second metal layer covering at least a portion of each of the lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer, and a second insulating layer disposed under the lower surface of the first insulating layer to cover at least a portion of a lower surface of the first wiring layer, and including the non-photosensitive insulating material.

Disclosed herein are a copper clad laminate, a printed circuit board, and a method of manufacturing the same. The copper clad laminate includes: an insulating layer having one surface and the other surface; and first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, wherein one surface of the insulating layer contacts the rough surface of the first copper foil layer and the other surface of the insulating layer contacts the smooth surface of the second copper foil layer.

A manufacturing of a package carrier includes the following steps. Two base metal layers are bonded together. Two supporting layers are laminated onto the base metal layers respectively. Two release metal films are disposed on the supporting layers respectively. Each release metal film includes a first metal film and a second metal film separable from each other. Two first patterned metal layers are formed on the release metal films respectively. Each first patterned metal layer includes a pad pattern. Two dielectric layers are formed on the release metal films respectively and cover the corresponding first patterned metal layers. Each dielectric layer has a conductive via connecting to the corresponding pad pattern. Two second patterned metal layers are formed on the dielectric layers respectively. Each second patterned metal layer at least covers the conductive via. The base metal layers are separated from each other to form two independent package carriers.

A circuit board including a substrate, a photo imageable dielectric layer and a plurality of conductive bumps is provided. The substrate has a first surface and a first circuit layer, wherein the first surface has a chip disposing area and an electrical connection area, and the first circuit layer is embedded in the first surface. The photo imageable dielectric layer is disposed on the electrical connection area and has a plurality of openings, wherein parts of the first circuit layer is exposed by the openings. The conductive bumps are disposed at the openings respectively and connected to the first circuit layer, wherein a side surface of each of the conductive bumps is at least partially covered by the photo imageable dielectric layer. In addition, a manufacturing method of the circuit board is also provided.