A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.

A printed circuit board with high-capacity and high-current copper circuit includes a conductive trace, a first protecting layer, and a second protecting layer on opposite sides of the conductive trace. The conductive trace includes a basic conductive trace pattern, a first conductive trace pattern, and a second conductive trace pattern. The first and second conductive trace patterns are directly formed on opposite surfaces of the basic copper conductive trace pattern. A width of trace of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.

A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.

A conductive tape formed by laying a conductive pathway on a tape layer is disclosed. Various apparatus and methods for laying conductive pathways to form conductive tape are disclosed. The conductive pathways may be laid by varying the lateral position of the conductive pathway on the tape substrate. Such patterns all stretchable conductive tape to be realized. Multiple conductive pathways may be laid in the tape and the lateral separation of the pathways in the tape may vary. In some embodiments the pathways are formed from conductive yarn or by printing or laying conductive ink.

A metal strip and a coil coating process for multilayer coating of an endless metal strip are disclosed in which a curable polymer primer is applied to a flat side of the metal strip with the aid of a roller application in order to form an electrically insulating primer layer, a curable polymer varnish is applied to this primer layer with the aid of a roller application and cured in order to form an electrically insulating varnish layer, and at least one electric conductor layer is printed at least in some areas between the primer layer and the varnish layer. In order to enable a stable and inexpensive electrical functionalization of a metal strip, it is proposed that an electrically polarizable layer be applied to at least some regions of the electric conductor layer and that the electric conductor layer and electrically polarizable layer be applied by means of a wet-on-wet process.

A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.

In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

A method is disclosed for applying an electrical conductor to an electrically insulating substrate, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded to the grooves adheres to the substrate. The membrane(s) and the substrate are separated and the composition in the groove is left on the surface of the electrically insulating substrate. The electrically conductive particles in the composition are then sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

Various sensors and methods of assembling sensors are described. In some embodiments, the sensor assembly includes a first end, a body portion, and a second end. The first end can include a neck portion and a connector portion and the second end can include a flap, a first component, a neck portion, and a second component. A method is also described for sensor folding. The method can include using a circuit with an attached emitter and a detector that is separated by a portion of the circuit. The method can also include folding the portion of the circuit such that a first fold is created through the emitter and folding the portion of the circuit such that a second fold is created such that the first fold and second fold form an angle.