A reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a roller having a cylindrical shape, configured to rotate, and on which a substrate is wound; and a film body that is formed between the roller and the substrate to surround a surface of the roller and is rotatable, wherein the roller and the film body are separately rotated from each other.

Disclosed in a reel-to-reel surface press apparatus. The reel-to-reel surface press apparatus includes an uncoiler and a recoiler, both transferring a component in a reel-to-reel method, a press disposed between the uncoiler and the recoiler, comprising a press plate pressing the component, and having a plurality of reference holes at an equal pitch along an edge of the press plate, a feeder disposed at the rear of the uncoiler and moving the component, and a controller configured to control the component to be transferred based on at least any one of the plurality of reference holes.

Disclosed are a multilayer circuit board manufacturing apparatus and a multilayer circuit board manufacturing method. The present disclosure includes: a plurality of uncoilers configured to supply a plurality of different members; and a compressing machine configured to bond the members, which are supplied from the respective uncoilers, to each other. The compressing machine includes: a belt that rotates in contact with one surface of one of the plurality of members; and a pressing device which is located inside the belt and spaced apart from the belt, and presses the belt toward the member in a non-contact manner.

A reel-to-reel method to laser-ablate a circuitry pattern on the fly in a reel-to-reel machine as part of a process to fabricate a printed flexible circuit. The laser ablation method includes using an appropriate laser to irradiate a metal sheet thus ablating the edges of an intended circuitry pattern. Slugs can be removed by using an optional sacrificial liner, and the slugs can be optionally ablated into smaller parts first. The laser ablation can also include an optional method of creating tie bars to provide structural support to the web of circuitry patterns.

A system for manufacturing a printed circuit board includes a coverlay supply apparatus configured to supply a coverlay; a printed circuit board supply apparatus configured to supply a printed circuit board; and a pre-bonding apparatus configured to pre-bond the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus, thereby discharging a first composite board.

Provided is a roll-to-roll copper foil laminating device. The device comprises a dry film holder shaft, a copper foil holder shaft, and a dry film roll connected to the dry film holder shaft; an outer surface of the copper foil frame shaft is wound with a copper foil roll. Before the dry film roll contacts a diffuser roller, the dry film roll goes through an EPC correction structure and remain in a state of active bonding; the distance from the dry film roll to the diffuser roller is 1.5 times a distance from the copper foil roll to the diffuser roller; a rotation axis of the dry film holder shaft and a rotation axis of the copper foil holder shaft move synchronously with an outer spin column.

An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

Provided is an automatic roll-to-roll quick press for flexible plates. The quick press comprises a lower film part and an upper film part parallel and movably attached to the lower film part. A right end of the lower film part is vertically connected to a transmission belt; a right end of the transmission belt is connected with a first pressing part; a top of the first pressing part is connected with a second pressing part; a second pressing plate part of the second pressing part comprises a flatness detection tube; there are four large infrared detectors inside the flatness detection tube, and four small infrared detectors inside; the detector scans a total of eight directions, and the scanning area covers the entire cylinder.

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.