The present disclosure discloses a circuit component and a method for manufacturing the same and a bonding device. The circuit component comprises a first circuit board and a second circuit board, wherein at least one of the first circuit board and the second circuit board comprises a bonding detection layer configured to be capable of detecting a bonding parameter between the first circuit board and the second circuit board; and emitting a detection signal when the bonding parameter reaches a preset value.

Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness. The black photosensitive resin composition contains at least (A) a binder polymer, (B) a thermosetting resin, (C) a flame retardant substantially insoluble in an organic solvent, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent, or contains at least (A) a binder polymer, (B) a thermosetting resin, (G) spherical organic beads, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent.

A substrate inspection device for inspecting a flexible printed board to determine whether the transparent adhesive material is properly applied thereto comprises: a substrate reading device which irradiates the flexible printed board with visible light to acquire image data; an adhesive material position determination unit which determines a position of adhesive material CAD data corresponding to the transparent adhesive material with respect to blue color image data among the image data corresponding to blue light which is readily absorbed by polyimide, to create adhesive material alignment data in which the adhesive material CAD data is superposed; an edge enhancing unit which performs processing, on the blue color image data, to enhance an edge of the transparent adhesive material; and a straight line determination unit which determines whether the edge of the transparent adhesive material is present in edge enhanced data in which the edge of the transparent adhesive material is enhanced.

According to a resin composition for a pigment-containing insulating film which resin composition contains at least a (A) binder polymer and (B) pigment-containing cross-linked polymer particles, it is possible to provide a resin composition for a pigment-containing insulating film which resin composition is excellent in tack property after drying and allows a resultant pigment-containing insulating film to be excellent in flexibility and electrical insulation reliability and to be small in warpage after curing, a resin film for a pigment-containing insulating film, a pigment-containing insulating film, and a printed wiring board provided with a pigment-containing insulating film.

Aboard inspection device includes: an imaging device that takes an image of an area on the board where the adhesive is applied; a CPU that specifies, by a first procedure, a center portion area of the adhesive in the image; specifies, by a second procedure, a foot portion area of the adhesive around the center portion area in the image; specifies an entire area of the adhesive based on the center portion area and the foot portion area; and based on the entire area of the adhesive, determines whether a quality of the adhesive is good or poor. The adhesive has a red color and is applied on a green resist area, and when specifying the foot portion area, the CPU extracts, an area of lower saturation than a predetermined saturation reference value from a saturation image based on the image.

A method (200) for making a lighting device is provided. The lighting device comprises a carrier having a side on which lighting elements are to be mounted in a selected arrangement in relation to each other using the surface-mount equipment. The method comprises marking (201) on the side of the carrier, using a marking substance comprising an ink composition, indications of the positions on the side of the carrier where the lighting elements are to be placed in order for the lighting elements to become mounted on the side of the carrier according to the selected arrangement of the lighting elements in relation to each other, wherein at least one of the surface-mount equipment or the marking substance is arranged such that the marking substance is detectable by the surface-mount equipment. Using the surface-mount equipment and based on the indications marked on the side of the carrier, the lighting elements are placed (204) on the side of the carrier so that the lighting elements become mounted on the side of the carrier in accordance with the selected arrangement of the lighting elements in relation to each other.