The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.

The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.

An electronic card comprising: a first card portion including lightning protection components, a first ground plane and a first ground zone; a second card portion comprising functional components, a second ground plane and a second ground zone; a third card portion, which separates and electrically isolates the first ground plane and the first ground zone from the second ground plane and from the second ground zone; the first ground zone and the second ground zone being unvarnished; the first ground zone and the second ground zone being arranged in order to be applied onto a housing element that is electrically conductive and that belongs to a housing in which the electronic card is integrated.

The present application discloses a semiconductor device with an interface structure and a method for fabricating the interface structure. The interface structure includes an interface board configured to be fixed onto and electrically coupled to a chuck of a testing equipment, and a first object positioned on a first surface of the interface board and electrically coupled to the interface board. The first object is configured to be analyzed by the testing equipment.

Methods, systems, and computer program products for determining a property of construction material. According to one aspect, a material property gauge operable to determine a property of construction material is disclosed. The gauge may include an electromagnetic sensor operable to measure a response of construction material to an electromagnetic field. Further, the electromagnetic sensor may be operable to produce a signal representing the measured response by the construction material to the electromagnetic field. An acoustic detector may be operable to detect a response of the construction material to the acoustical energy. Further, the acoustic detector may be operable to produce a signal representing the detected response by the construction material to the acoustical energy. A material property calculation function may be configured to calculate a property value associated with the construction material based upon the signals produced by the electromagnetic sensor and the acoustic detector.

A stretchable display device according to one or more embodiments of the present disclosure includes a lower substrate including a display area, a first non-display area disposed at a left side and a right side of the display area, and a second non-display area disposed above and below the display area and the first non-display area, a plurality of first substrates disposed on the lower substrate in the display area and defining a plurality of pixels, a plurality of second substrates disposed on the lower substrate in the first non-display area and including a gate driver disposed thereon, and an inspection unit disposed on the lower substrate in the second non-display area and including a plurality of inspection substrates connected to a second substrate which is the most adjacent to the second non-display area among the plurality of second substrates.

A display module and its formation method are provided in the present disclosure. The display module includes a main flexible circuit board, including a first binding terminal, a second binding terminal, a first test point and a second test point, where the first test point is electrically connected to the first binding terminal, and the second test point is electrically connected to the second binding terminal; and further includes an auxiliary flexible circuit board, including a third binding terminal and a fourth binding terminal, where the third binding terminal is electrically connected to the fourth binding terminal, the first binding terminal is disposed corresponding to the third binding terminal, and the second binding terminal is disposed corresponding to the fourth binding terminal.

An electronic device, which includes at least a first part and a second part bonded to each other is provided. The first part includes a first bonding area. The first bonding area includes at least one first testing area. The first testing area includes a plurality of testing pads. The second part includes a second boding area corresponding to the first bonding area. The second bonding area includes a plurality of testing terminals, and includes at least one second testing area respectively corresponding to the at least one first testing area. The second testing area includes a plurality of testing pins. The plurality of testing pads, the plurality of testing terminals and the plurality of testing pins are configured to form a current channel and a voltage testing channel, for measuring a resistance of bonded testing pads and testing pins on both the current channel and the voltage testing channel.

A wiring assembly board for assembling a wire harness. The wire harness comprises a plurality of wires connected between a plurality of wiring connectors, each connector comprising an array of wire terminals. The wiring assembly board comprises an assembly surface and a plurality of test connectors provided on the assembly surface. Each test connector is for connection to a respective wiring connector and comprises an array of test terminals for establishing an electrical connection with the respective array of wire terminals once the wiring and test connectors have been connected. A microcomputer is associated with each test connector and comprises an interface for individually transmitting or receiving test signals though each test terminal of the respective test connector.

The present disclosure relates to a multilayer ceramic substrate preparation method. The multilayer ceramic substrate preparation method according to the present disclosure includes firing a plurality of ceramic green sheets, to create a plurality of ceramic thin films; forming a via hall in each of the plurality of ceramic thin films; filling the via hall of the plurality of ceramic thin films with conductive paste, and heat treating the via hall filled with the conductive paste, to form a via electrode; printing a pattern on a cross section of each of the plurality of ceramic thin films, and heat treating the printed pattern, to form an inner electrode; applying a bonding agent on the cross section of each of the ceramic thin films excluding an uppermost ceramic thin film of the plurality of ceramic thin films; aligning and laminating each of the plurality of ceramic thin films such that each of the plurality of ceramic thin films is electrically connected through the via electrode and the inner electrode; and firing or heat treating the laminated plurality of ceramic thin films.