A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), ##STR00001## in formula (I), R.sub.1 and R.sub.2 are independently —H, —CH.sub.3, or —C(CH.sub.3); and (C) an optional filler.

A fixing jig is provided, including a supporting base, a fixing plate, and a fixing component. The supporting base includes a first upper surface. The fixing plate is disposed on the supporting base. A side of the fixing plate is pivotally connected to the supporting base and includes a second upper surface, a bottom surface, and via a hole. The fixing component presses the fixing plate on the second upper surface. The fixing jig can fix an object pending testing and allows one flexible electric circuit board of the object pending testing to be exposed outside of the fixing jig, so that when performing a pull force test, this can allow an angle between two flexible electric circuit boards to be 90 degrees, thereby improving accuracy of an experimental result.

There is provided a control circuit board including a board, an integrated circuit, and a pad group. The board includes a first surface and a second surface, where the first surface and the second surface are on opposite sides of the board. The integrated circuit is disposed on the first surface of the board. The pad group is disposed on the second surface of the board and is electrically connected to the integrated circuit through a through-hole formed in the board.

An electronic apparatus including a display module having a front surface and a rear surface opposing the front surface and including pixels disposed on the front surface and a display pad connected to the pixels and exposed from the rear surface, a protective film disposed on the rear surface of the display module, a circuit board disposed between the display module and the protective film and having a front surface facing the rear surface of the display module and a rear surface, the circuit board including a first substrate pad connected to the display pad and exposed from the front surface of the circuit board and a second substrate pad exposed from the rear surface of the circuit board, and a driving element connected to the second substrate pad to drive the pixels, in which the second substrate pad and the protective film are spaced apart from each other.

Provided is an immunity evaluation system that enables design feedback in consideration of a subject wiring and an improvement amount for improving an electromagnetic noise resistance of a circuit board. An immunity evaluation device includes: a storage unit configured to store characteristic data including probe-circuit board wiring coupling characteristics which are determined by a combination of a near-field probe and circuit board characteristics, and a test result; and an IC reaching signal level estimation unit configured to estimate a signal level reaching a terminal of an evaluation target IC. The immunity evaluation device receives board design information, information of the near-field probe, and test waveform instruction information of a signal applied to the near-field probe. The IC reaching signal level estimation unit reads the coupling characteristics from the storage unit based on the board design information of a test subject circuit board and the information of the near-field probe, and outputs a value of the IC reaching signal level reaching a terminal of the evaluation target IC from the board design information of the test subject circuit board, the information of the near-field probe, and the coupling characteristics.

A control device including a solder joint life predictor includes: a temperature sensor that measures temperature of a solder joint on an electronic circuit board that drives a heater and a motor; a storage that stores a reference acceleration factor that is an acceleration factor based on a test condition of a thermal shock test and a reference condition in an environment in which the electrical appliance is used; a calculator that calculates an actual acceleration factor from a temperature variation range and a maximum reached temperature of the solder joint during one cycle from start to end of driving of the heater or the motor; and a determiner that predicts the life of the solder joint by comparing the integrated value of the acceleration factor ratios with a threshold.

A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

A method of producing a MEMS assembly includes: producing an OIS/IS subassembly, wherein the OIS/IS subassembly includes an optical image stabilizer and an image sensor; and coupling the OIS/IS subassembly to an AF subassembly to form an OIS/IS/AF assembly.

An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10.sup.−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10.sup.−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

A horizontal probing fixture includes two bridge modules each having two spaced-apart pedestals, and a bridge plate connecting the pedestals. A first sliding unit for carrying and sliding a probe device includes two first sliding blocks respectively mounted and slidable on the bridge plates of the bridge modules, a first slide plate having two opposite ends respectively connecting the first sliding blocks, and two locking modules respectively disposed on the first sliding blocks. Each first sliding block has a bottom end complementarily engaged to and slidable on the bridge plate of one of the bridge modules. The locking modules are operable to respectively lock or unlock the first sliding blocks relative to the bridge plates.