A dispensing system includes an optional pre-heat station configured to receive an electronic substrate, a dispense station configured to dispense material on the electronic substrate received from the optional pre-heat station, an optional post-heat station configured to receive the electronic substrate from the dispense station, and a non-contact sensor positioned above the electronic substrate on at least one of the optional pre-heat station, the dispense station, and the optional post-heat station.

An image processing device that processes an image in which a wiring pattern is drawn and outputs the image as raster data in which formation content of wiring print dots is defined for each pixel, includes an input section that receives the image, a scan section that sequentially performs scanning in a scan direction at intervals of the pixel width, a calculation section that calculates an intersection-to-intersection distance in the scan direction based on positions of the intersection points, and a determination section that determines a line width of the wire in the scan direction and determine formation of dots for the determined line width for each pixel based on the intersection-to-intersection distance, the prescribed width, and a line width of an inclination wire which is the line width, in the scan direction, of a wire inclined according to the prescribed angle.

According to one embodiment, an electronic device includes a flexible film-like insulating base and a sensor disposed on the insulating base, and the insulating base includes a detection area in which the sensor is disposed and a peripheral area on an outer side of the detection area, and the peripheral area includes a reinforcement member provided thereon to extend along an outer circumference of the insulating base.

The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.

A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.

An apparatus is configured to print a circuit board using conductive and nonconductive printing materials in accordance with parameters. A database stores information correlating characteristics of printing materials with shelf life and/or age of the printing materials, and/or environmental conditions. The apparatus either prompts operator to make printing parameter adjustments or automatically optimizes printing parameters based on information stored in the database and the environmental conditions. The apparatus optionally further optimizes printing parameters based on age of a print head and positioning mechanisms.

A method of manufacturing a printed circuit board includes forming an intermediate layer on a first conductive layer disposed on a first insulating layer, forming a second conductive layer and a second insulating layer on the intermediate layer, separating the first insulating layer from at least one portion of the first conductive layer, and etching the first conductive layer and the intermediate layer. After the etching, a surface of the second conductive layer protrudes further than a surface of the second insulating layer. The intermediate layer before the etching includes a portion overlapping the second conductive layer in a vertical direction and another portion not overlapping the second conductive layer in the vertical direction.

In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.

Methods and systems for making a multi-layer circuit board are disclosed, including electrically connecting a boring device with a plated multi-layered circuit board; cutting a first bore having a first diameter through a first layer of the plated multi-layered circuit board; reciprocally extending a second cutting device a first predetermined distance into a barrel plated multi-layered circuit board and retracting the cutting device a second predetermined distance that is less than the first predetermined distance to form a second bore; after each retraction, sensing for electrical contact indicating a closed circuit between the cutting device and the plated multi-layered circuit board; if a closed circuit is sensed, determining if the second bore has reached an expected depth of a contact layer; and if the expected depth of the contact layer has not been reached, determining that a sliver has been formed in the barrel.

A circuit forming method for forming a circuit with a curable resin and a conductive fluid, the method including a setting step of setting errors that occur during a circuit forming work to an automatic release error and a non-release error for each type of error, the automatic release error being to be automatically released, and the non-release error being not to be automatically released, a determination step of determining whether an error has occurred in work when the circuit is formed, and a re-execution step of automatically re-executing work determined that the error has occurred in the determination step, in a case where the error of the work is set to the automatic release error in the setting step.