There is provided technology which is a component mounting machine which mounts electronic components onto a circuit substrate and is capable of displaying a movable region of an inner portion of the component mounting machine within a same image. The component mounting machine is provided with a fixed camera which monitors the inner portion of the component mounting machine and a display section which is capable of displaying a captured image of the fixed camera. The fixed camera is capable of imaging a range from a pickup position at which the suction nozzle picks up the electronic component which is supplied from the component feeder to a mounting position at which the electronic component is mounted onto the circuit substrate within the same image.

A drill hole inspection method for using a drill hole inspection system to inspect a drill hole of a printed circuit board (PCB) is provided. The drill hole inspection method includes: scanning the PCB to obtain 3-dimensional (3D) image voxel data of the PCB; determining a first-dimension interval corresponding to the PCB along one direction of the 3D image voxel data; determining, in a plane of the 3D image voxel data which is orthogonal to the direction, a 2-dimensional (2D) position corresponding to the drill hole; extracting a portion of the 3D image voxel data as drill hole voxel data according to the first-dimension interval and the 2D position; analyzing the drill hole voxel data to obtain an inspection result of the drill hole; and outputting the inspection result through an output component. In addition, a drill hole inspection system and an inspection device using the same are also provided.

A method for managing an assembling process of an electrical product. The electrical product at least includes a substrate with a semiconductor component mounted thereon and a power supply circuit. In the method, during assembly of the electrical product, a potential difference between two points on electric wires or signal wires electrically connected with an impedance element, which is inside the electrical product, interposed therebetween is constantly measured. Also, in the method, if a change that exceeds a predetermined threshold value, based on which electrostatic discharge noise and a normal potential range are distinguished from each other, occurs in the potential difference between the two points, measurement data on the potential difference between the two points is recorded and a mark for indicating that the electrical product was affected by electrostatic discharge is provided to the electrical product.

The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the chamber 40, a pump 23 that evacuates the chamber 40, and a control portion 61 that calculates the amount of decrease in the degree of vacuum when evacuating the chamber 40 using a predetermined pump output, sets the calculated value as a reference value and switches an evacuation property from the evacuation property including a lower pump output to the evacuation property including a higher pump output when the calculated amount of decrease in degree of vacuum in real time has become smaller than the reference value.

A dispensing system for depositing material on an electronic substrate includes a frame, a dispensing unit gantry movably coupled to the frame, a dispensing unit coupled to the dispensing unit gantry, a vision system gantry coupled to the frame, and a vision system coupled to the vision system gantry. A controller is configured to manipulate the vision system with the vision gantry system to move to the position defined by a feature, to acquire an image of at least a portion of a feature, to search for an edge of interest along a center of the image, and to return a value indicating an offset of zero (0), which is interpreted as the location that is exactly as expected, and an offset that reflects where the edge of interest intersected that axis location.

A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.

A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded.

A component determination system for determining, in a case when a first component to be mounted on a board by a first mounting operation and a second component mounted on the board by a second mounting operation have a particular corresponding relationship, whether a combination of the first component and the second component mounted is permissible, the component determination system including: a first characteristic information acquiring section configured to acquire first characteristic information of the first component for which the first mounting operation has been completed; a second characteristic information acquiring section configured to acquire second characteristic information of the second component prepared prior to the second mounting operation; and a combination determining section configured to determine whether to allow the combination of the first component and the second component based on the acquired first characteristic information and the acquired second characteristic information.

Provided are: an apparatus and a method for producing a (metal plate)-(ceramic board) laminated assembly, a bonding material and a metal plate during the bonding of the metal plate to the ceramic board through the bonding-material layer and an apparatus and a method for producing a power-module substrate. An apparatus for producing a (metal plate)-(ceramic board) laminated assembly by laminating a metal plate having a temporary bonding material formed thereon on a ceramic board having a bonding-material layer formed thereon, the apparatus being equipped with: a conveying device which conveys the metal plate onto the ceramic board to laminate the ceramic board and the metal plate on each other; and a heating device which is arranged in the middle of a passage of the conveyance of the metal plate by the conveying device and melts the temporary-bonding material on the metal plate.

A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.