An electronic component mounting machine includes an image-capturing device and a control device. The image-capturing device captures the images of sub-fiducial marks and main fiducial marks. When the control device can read the main fiducial marks from the images captured by the image-capturing device, the control device determines the mounting positions of the electronic components with respect to a substrate with reference to the main fiducial marks. On the other hand, when the main fiducial marks cannot be read from the images due to a print defect of the main fiducial marks, the control device determines the mounting positions of the electronic components with respect to the substrate with reference to the sub-fiducial marks which are the reference sources of the image-capturing positions of the main fiducial marks.

The storage device unit includes: a substrate having a main surface and having a plurality of wiring layers stacked together; and a storage device that has a plate shape having a first surface and is disposed on the substrate, the first surface facing the main surface. The plurality of wiring layers includes a heat-generating layer having a heat-generating circuit.

The discussion relates to thermal management. One example can include a circuit board including inner, intermediate, and outer generally concentric zones and a cryogenically cooled chip located in the inner zone as well as non-cryogenic electronic components positioned in the outer zone. In this example, the intermediate zone can have a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.

An example system for maintaining the shape of a circuit board includes metal balls that are configured not to collapse in whole or part in response to a force below a predefined force and a temperature below a predefined temperature. The metal balls are configured to support a substrate and are part of electrical connections between the substrate and a circuit board. The system includes a fixture configured to apply force to the substrate while the substrate is subjected to the temperature. The fixture is configured to distribute the force across a surface of the substrate that is not in contact with the metal balls such that the force applied by the fixture and the support of the substrate by the metal balls maintains a shape of the substrate at the temperature.

A filter of the present invention creates a cavity filter that can be embedded within the inner layers of a printed circuit board. The embodiment can provide for a tunable microwave filter with lower loss, lower manufacturing cost and higher production yields. In addition, the tunable microwave includes a temperature compensation means to accommodate an electrical characteristic of filter with regard to the temperature variation. Such temperature compensation embodiment can be embedded into the upper layer communicably associated with the processor. For performing intelligent temperature compensation, the processor can include a look-up table of tuning values for controlling can store a set of temperature offset value that can modify the tuning table.

An electronic device comprises a metal casing, a circuit board and a heating assembly. The metal casing has a storage space. The circuit board is located in the storage space. The heating assembly comprises a first heating part and a second heating part. The first heating part is in thermal contact with the circuit board, and the second heating part is in thermal contact with the metal casing.

A network device that includes a temperature sensor module is provided. The network device can include a host printed circuit board, one or more processors mounted on a surface of the host printed circuit board, a port protruding from the surface of the host printed circuit board, and a temperature sensor module that is raised over the surface of the host printed circuit board to provide thermal decoupling from the surface of the host printed circuit board. The temperature sensor module can include a sensor printed circuit board, a temperature sensor integrated circuit die disposed on a first side of the sensor printed circuit board, and an exposed conductive pad disposed on a second side of the sensor printed circuit board. The temperature sensor module can include multiple exposed contacts or a plug configured to mate with the protruding port.

A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

A board printing apparatus includes a board working table, a first printing table, a second printing table, and a control portion controlling printing operations. The control portion is configured to perform second printing on a board held by the board working table by a large component mask of the second printing table after a first printing performed on the board held by the board working table by a small component mask of the first printing table.