Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.

Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.

An electrical device, comprising a softening polymer layer, an electrode layer on a surface of the softening polymer layer and a cover polymer layer on the surface of the softening polymer layer. An opening in the polymer cover layer is filled with a reflowed solder, one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer, and another end of the reflowed solder contacts an electrical connector electrode of the device.

A circuit board assembly includes a connection circuit board, a near field communication antenna and solders. The connection circuit board includes circuit board pads. The near field communication antenna is attached to the connection circuit board, and the near field communication antenna includes: an antenna coil, antenna pads electrically connected to the antenna coil, and through holes penetrating the antenna pads and disposed opposite to the circuit board pads. The solders are connected to the circuit board pads through the through holes.

An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.

An electronic device and associated methods are disclosed. In one example, the electronic device includes a first rigid substrate, a second rigid substrate, a flexible substrate comprising a first portion attached to the first rigid substrate, a second portion attached to the second rigid substrate, a middle portion connecting the first portion to the second portion, wherein the middle portion is bent, and metallic traces therethrough, and a component forming a direct interface with the middle portion of the flexible substrate, the component electrically coupled to the metallic traces. In selected examples, the device further includes a casing.

A battery pack comprises a pair of physically separate battery cells share a single protection circuit module (PCM). Each further saw comprises a respective pair of electrodes, with both pairs of electrodes being connected to a single, common protection circuit board (PCB) of the PCM. The common PCM may be located in a spacing between adjacent ends of the batteries such that a widthwise dimension of the PCB has an upright orientation between the two batteries.

A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.

Disclosed herein are a method of fabricating a stretchable electrical circuit and an apparatus for fabricating a stretchable electrical circuit, wherein the method of fabricating a stretchable electrical circuit includes stretching a stretchable substrate, forming a plurality of alignment marks on a surface of the stretchable substrate, forming a first axis extending from a line connecting two alignment marks among the plurality of alignment marks, and a second axis perpendicular to the first axis, marking one point of the surface of the stretched stretchable substrate with coordinates made by the first axis and the second axis, and disposing electrical components using the coordinates.

A tubular solid state lighting device is disclosed having a light transmissive tube. A flexible carrier strip having a first portion attached to an inner wall section of the tube, and comprises an elongate major surface and a further elongate major surface opposite the elongate major surface. The elongate major surface carries a plurality of solid state lighting elements on the first portion and a plurality of electrically conductive contacts on adjacent terminal regions separated by a recess at one end. The flexible carrier strip is soldered to a rigid printed circuit board comprising a first major surface onto which a driver circuit for the solid state lighting elements is mounted facing the flexible carrier strip and a second major surface opposite the first major surface carrying a plurality of spatially separated soldering pads along an edge of the second major surface. The further elongate major surface contacts the second major surface such that each electrically conductive contact is aligned with one of the spatially separated soldering pads and is soldered to said soldering pad by a solder portion extending over the terminal region carrying said electrically conductive contact. A method of forming such an assembly and an assembly method for a tubular lighting device are also disclosed.