A connector is mounted on an input-output board. The connector is interposed between the input-output board and a CPU board, and thereby a plurality of pads of the input-output board and a plurality of pads of the CPU board are respectively electrically connected. The connector includes a rectangular flat-plate housing having a first positioning hole and a second positioning hole, and at least one contact row held on the housing. The first positioning hole is formed at a first housing corner part of the housing. The second positioning hole is formed at a fourth housing corner part, which is at a diagonal position with respect to the first housing corner part, of the housing.

A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.

Precisely aligned assemblies can be complex, time consuming, labor intensive, and expensive and a need exists for better alternatives. Systems and methods described herein yield high precision printed circuit board assemblies (PCBAs) that contain pre-built alignment features to address this need. The work of precisely locating components on the PCBA to a final position in the overall assembly is already built in to the board. Locating features are used to precisely position one or more components, such as optical components, electro optical components, or mechanical components in assemblies. The locating features may be used to constrain the positions of those components, such as by kinematic coupling, solder wetting dynamics, semiconductor cleaving, dicing, photolithographic techniques for etching, constant contact force, and advanced adhesive technology to result in optical level positioning that significantly improves or eliminates assembly alignment challenges.

An optical module includes: an optical element; a housing configured to house the optical element; as electrical terminal arranged on an outer peripheral surface of the housing and electrically connected to an inside of the housing; and a positioning unit configured to determine a relative position of a wiring board electrically connected to the electrical terminal from outside of the housing, with respect to the electrical terminal.

A substrate for contacting an electrical pin arranged in a housing includes a base having a recess receiving the electrical pin, a metal leadframe having a contacting region electrically and/or thermally contacting the electrical pin, and a contact pin extending along a mating direction in a plane parallel to the metal leadframe and configured to electrically contact a mating contact pin of a mating connector. The metal leadframe is rigidly fixed to the base to prevent a relative movement between the metal leadframe and the substrate. The substrate is movable with respect to the housing along a locking direction from an unlocked position where the substrate is not locked to the housing to a locked position in which the substrate is locked to the housing. A movement of the contacting region with respect to the electrical pin is prevented in the locked position.

Current measurement devices for printed circuit board mounting are disclosed herein. The current measurement devices include a hollow and flexible core to improve response to a primary signal and decrease weight. The current measurement device includes a housing with guides to maintain alignment of the core. An electromagnetic shield may be placed between the circumference of the core and the housing. The housing may include apertures to facilitate washing. The current measurement device may include a primary conductor external to the housing.

A three-dimensional optoelectronic device package is disclosed. The three-dimensional optoelectronic device package comprises a first board having at least one surface on which one or more optoelectronic devices is disposed, and a second board having at least one surface on which a plurality of optoelectronic devices is disposed. A side of the second board is attached to the surface of the first board on which one or more optoelectronic devices is disposed to form an angle between the surface of the first board on which one or more optoelectronic devices is disposed and the surface of the second board on which one or more optoelectronic devices is disposed. A method for manufacturing a three-dimensional optoelectronic device package is also disclosed.

A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.

A stencil printer for printing an assembly material on an electronic substrate includes a frame, a stencil coupled to the frame, the stencil having apertures formed therein, a support assembly coupled to the frame, the support assembly being configured to support the electronic substrate, a print head gantry coupled to the frame, and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The stencil printer further comprises a verification system to determine whether an item placed within the stencil printer is properly installed within the stencil printer.