Techniques and mechanisms for controlling configurable circuitry including an antifuse. In an embodiment, the antifuse is disposed in or on a substrate, the antifuse configured to form a solder joint to facilitate interconnection of circuit components. Control circuitry to operate with the antifuse is disposed in, or at a side of, the same substrate. The antifuse is activated based on a voltage provided at an input node, where the control circuitry automatically transitions through a pre-determined sequence of states in response to the voltage. The pre-determined sequence of states coordinates activation of one or more fuses and switched coupling one or more circuit components to the antifuse. In another embodiment, multiple antifuses, variously disposed in or on the substrate, are configured each to be activated based on the voltage provided at an input node.

A printed circuit board (1) for an LED module (2) comprises mechanical weaknesses (11) in a substrate of the printed circuit board (1), which weaknesses form at least one at least electrically interruptible substrate bridge (12A, 12B), and a plug connector (13) having four terminals (13.1-13.4) A first LED light source (14) can be connected between a first anode-cathode pair (13.1, 13.4) of the four terminals (13.1-13.4), and a second LED light source (15) can be connected between a second anode-cathode pair (13.2, 13.3) of the four terminals (13.1-13.4) A pair of anodes (13.1,13.2) of the four terminals (13.1-13.4) is galvanically interconnected via a first (12A) of the at least one substrate bridges (12A, 12B) The printed circuit board (1) can be connected using the plug connector (13) to at least one LED driver for the LED module (2) via two or three separate galvanic connections depending on the state of the at least one substrate bridge (12A, 12B).

A position indicator includes: a chassis; a substrate disposed inside the chassis; a coil; capacitors disposed on the substrate; interconnects disposed on the substrate such that each at least partially connects a respective one of the capacitors to the coil in parallel; and pairs of land patterns. Each pair of land patterns includes a first land pattern and a second land pattern. Each of the interconnects has a first end connected to a first end of the coil and a second end connected to a second end of the coil, and is connected to one of the capacitors. The pairs of land patterns are disposed such that each of the interconnects is at least partially interposed between the first land pattern and the second land pattern of one of the pairs of land patterns.

A circuit arrangement has a populated circuit carrier and includes a flat insulation carrier having a top side and a patterned metallization layer on the top side and a first power semiconductor chip arranged on a first section of the metallization layer. The first power semiconductor chip has a first lower chip load terminal electrically conductively connected to the first section. A shunt resistor is arranged on a second section of the metallization layer. The shunt resistor has a lower main terminal electrically conductively connected to the second section. An electrically conductive connection is provided between the first section and the second section. The electrically conductive connection includes a constriction between the first section and the second section so that a current which flows between the first lower chip load terminal and the lower main terminal during operation of the circuit arrangement must pass through the constriction.

The invention relates to a variable sensor interface for a control unit, this variable sensor interface including a circuit board which is provided with components. In a sensor interface which can easily be used for the use of different sensor types, the circuit board has a predefined conductive track layout having a plurality of predefined mounting locations, the mounting locations being provided with components in a sensor-specific manner.

The present invention is used to carry out repairs on a defective circuit of a circuit board, with two conducting portions and a defective portion therebetween. The operating method comprises: using a laser light source of a single laser dual optical circuit repair member of a single laser repair module to emit an initial laser beam toward an energy distribution unit, thereby producing a first laser beam and a second laser beam; using a switching unit to mask the second laser beam, thereby transmitting the first laser beam toward the circuit board, to transform the defective portion into a sintered portion; and using the switching unit to mask the first laser beam, thereby transmitting the second laser beam toward the circuit board, thereby deflashing of the sintered portion, causing sintered sides of the sintered portion to be flush with two conducting sides of the two conducting portions.

A transmission cable includes a transmission cable, a first circuit board having a first power layout area, a first ground layout area, and a first circuit trace, and a second circuit board having a second power layout area, a second ground layout area, and a second circuit trace. The transmission cable includes a power wire, a pair of signal wires, and a drain wire. When the first power layout area, the first circuit trace, the second power layout area, and the second circuit trace are connected via a resistor, respectively, the drain wire connected between the first circuit trace and the second circuit trace will act as another power wire. Thus, a voltage drop at both ends of the transmission cable can be reduced by increasing the power wires to improve signal transmission quality.