An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.

A method for producing an electric component carrier for automobile applications, in particular an electric component carrier for a lock. The electric component carrier is equipped with a conductive track arrangement and a base plate, which supports the conductive track. In the initial state, the conductive track arrangement has one or more separation points depending upon the required mode of operation in the operational state. According to the invention, the conductive track arrangement in the initial state is coated at least partially with a casting compound by means of injection molding and then the separation point is introduced into the free region.

A part comprising a body and a film bonded to a surface of the body and incorporating an electronic circuit. This electronic circuit comprises at least one electronic component, conductive lines connected to the electronic component and at least two connection terminals positioned on at least one of the conductive lines, each connection terminal having a cross-section, in a plane parallel to the surface of the body, greater than twice the cross-section of a conductive line. By virtue of the connection terminals, which are distributed over the electronic circuit, it is possible to replace a faulty circuit segment with a repair circuit segment.

Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.

In an example, monitoring circuitry (307) includes a first ( ) and second (502) coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging (101). The monitored circuit has a resistance which is indicative of a status of a product (702) stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus (300) may determine the resistance of the monitored circuit via the first and second couplings.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

First and second sensor elements are arranged on a substrate. First sensor-wiring line is connected to the first sensor element. An insulating film covers the first sensor-wiring line. Second sensor-wiring line is connected to the second sensor element and separated from the first sensor-wiring line by the insulating film in the thickness direction. First and second terminal parts are for being connected to an external circuit board, and are provided at an end of the first sensor-wiring line and at an end of the second sensor-wiring line, respectively. First and second lead lines extend from the first and second terminal parts, respectively. The short-circuit wiring line connects the first and second lead lines to each other.

A programmable circuit includes an array of printed groups of microscopic transistors or diodes having pn junctions. The devices are pre-formed and printed as an ink and cured. The devices have a proper orientation and a reverse orientation after settling on a conductor layer. The devices are connected in parallel within small groups. To neutralize the reverse-oriented devices, a sufficient voltage is applied across the parallel-connected diodes to forward bias only the devices having the reverse orientation. This causes a sufficient current to flow through each of the reverse-orientated devices to destroy an electrical interface between an electrode of the devices and the conductor layer to create an open circuit, such that those devices do not affect a rectifying function of the devices in the group having the proper orientation. An interconnection conductor pattern may then interconnect the groups to form complex logic circuits.

A flex circuit system according to an exemplary aspect of the present disclosure includes, among other things, a substrate, at least one bus bar mounted to the substrate and at least one voltage sense lead integrated with the substrate.

A semiconductor device includes a substrate, a nonvolatile semiconductor memory disposed on a surface of the substrate, and a controller disposed on a surface of the controller. The substrate has a slit on an edge on which interface connection terminals are formed, a ground pattern, first and second wiring patterns that are electrically connected to the ground pattern and extend in a direction in which the slit extends, and a through hole that is formed between the first and second wiring patterns and is large enough along a dimension between the first and second wiring patterns to span substantially all of the spacing between the first and second wiring patterns.