An electronic component removal device comprising a cutting wire routed through a cutting region configured to receive an electronic component coupled to a substrate. The electronic component removal device can also include a leading actuator coupled to a leading end of the cutting wire to cause movement of the cutting wire in a cutting direction at a cutting speed. The electronic component removal device can further include a trailing resistance device coupled to a trailing end of the cutting wire to resist movement of the cutting wire in the cutting direction with a variable resistance. In addition, the electronic component removal device can include a leading tension sensor to sense a leading tension in the cutting wire between the cutting region and the leading actuator. The trailing resistance device can resist movement of the cutting wire with a resistance that varies based on the leading tension in the cutting wire.

Provided is a method for removing an electronic socket from a printed wiring board. The method comprises placing an embrittlement sheet over an electronic socket on a printed wiring board. The electronic socket is mounted to the printed wiring board using a plurality of hidden solder joints. The method further comprises causing the embrittlement sheet to melt. The melted embrittlement sheet wets the plurality of hidden solder joints. The electronic socket is removed from the printed wiring board by breaking the embrittled solder joints.

An improved memory module structure includes a printed circuit board, memory units disposed on the printed circuit board, and a connection interface disposed on the printed circuit board for connection with an electronic device. The printed circuit board includes a solder pad zone having solder pads electrically connected with the memory units and the connection interface. A conduction element is combined with the solder pad zone or at least one conductor line electrically connected, in the form of bridge connection, the solder pads, in order to have the solder pads electrically connected. A memory module modification method is also provided, including removing a register from an existing dual inline memory module to expose a solder pad zone, and disposing of a conduction element or arranging a conductor line to have the memory units and the connection interface of electrically connected to thereby form an improved memory module structure.

A circuit protection element includes a vertical wall substantially perpendicular to a mounting surface of a circuit board in a mounted state; a first mounting part formed by being bent from the first end part of the vertical wall once and substantially parallel to the mounting surface; the second mounting part formed by being bent from the second end part of the vertical wall once and substantially parallel to the mounting surface; an elastic deformation part formed so as to project from the vertical wall in a predetermined direction, which has the contact part in the vicinity of an end part thereof on the opposite side to the vertical wall, and accumulates an elastic stress caused by elastic deformation thereof; and the self-locking part formed on the vertical wall and the elastic deformation part for maintaining the elastic deformation part in a state elastically deformed.

A circuit protection element includes a first leg part formed by being bent once from a first end part of a ceiling part that is the bending reference plane; a second leg part formed by being bent once with respect to the bending reference plane; a first mounting part and a second mounting part each formed by being bent twice with respect to the bending reference plane so as to be flush mutually and parallel to a mounting surface of the circuit board; and a plastic deformation part (a curved part) set in a predetermined region of the second leg part and plastically deformed by applying a load in the vicinity of a second end part of the ceiling part toward the mounting surface of the circuit board.

A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mm.sup.2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6B/A1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100 C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

A circuit protection element includes a first leg part formed by being bent once from a first end part of a ceiling part that is the bending reference plane; a second leg part formed by being bent once with respect to the bending reference plane; a first mounting part and a second mounting part each formed by being bent twice with respect to the bending reference plane so as to be flush mutually and parallel to a mounting surface of the circuit board; and a plastic deformation part (a curved part) set in a predetermined region of the second leg part and plastically deformed by applying a load in the vicinity of a second end part of the ceiling part toward the mounting surface of the circuit board.

A method of performing a fully automated, single changeover process within a stencil printer includes identifying at least one item for replacement within the stencil printer, transporting an item to the stencil printer by a single change movable cart, removing a used item identified for replacement and delivering the used item to the movable cart, and installing a new item within the stencil printer from the movable cart. A system to perform a fully automated, single changeover process within a stencil printer includes a single change movable cart configured to transport an item to the stencil printer, remove a used item scheduled for replacement, and install the item within the stencil printer.

A stencil printer includes a frame, a stencil coupled to the frame, the stencil having apertures formed therein, a support assembly coupled to the frame, the support assembly including tooling configured to support the electronic substrate in a print position beneath the stencil, a print head assembly coupled to the frame in such a manner that the print head assembly is configured to traverse the stencil during print strokes, the print head assembly including a squeegee blade assembly and at least one paste cartridge to deposit solder paste on the stencil, and a robotic arm configured to perform functions within the stencil printer.

A delivery device is configured to deliver changeover and/or replacement items within a stencil printer. The delivery device includes a housing configured to support replacement and/or replenishment items, the housing having wheels or casters to enable the housing to roll along a relatively flat surface, at least one support structure configured to store items for the stencil printer, and one or more device configured to transport items from the delivery device to the stencil printer and from the stencil printer to the delivery device.